Abstract: A system may condition a plurality of sub-stacks of high-temperature SOEC/SOFC-type solid oxide cells forming a modular stack. Such a system may include: a thermal enclosure; a plurality of sub-stacks; a plurality of end plates, each having an upper face and a lower face, the surface of an upper face being of greater dimension than the surface of a lower face of a sub-stack, and the surface of a lower face being of greater dimension than the surface of an upper face of a sub-stack so as to obtain one or more free surfaces which are not superimposed with a sub-stack; a plurality of die-forming supports, including a recess; a plurality of flexible elements above a recess; a plurality of bearing elements capable of coming into contact with a flexible element so as to deform it.

Abstract: A structure for the testing of an electronic circuit for addressing a matrix of cells including a plurality of blocks containing at least one first material, piezoelectric and/or dielectric, the dielectric properties of which can be modulated according to the intensity of an electric field that is applied to it, at least one separation region between the blocks, the structure further including a shared electrode connected to a first end of the blocks containing the first material, a second end of the blocks containing the first material being arranged with respect to a face of the structure called “contact face”, so that when the contact face is disposed on the addressing circuit, the second end of the blocks is connected to at least one conductive stud of the addressing circuit.