Patents by Inventor Nicolas E. Sajot

Nicolas E. Sajot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for packaging plastic materials like hot melt adhesives
    Patent number: 7572494
    Abstract: A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging hot melt adhesives, the resulting package formed thereby, and the film composition used therein. The method is preferably a coextrusion process for packaging a pressure sensitive hot melt adhesive by extruding a hot melt adhesive through a die orifice, and coextruding a wax-based polymeric film to surround the hot melt adhesive. The coated adhesive may then be formed into individual packaged units having a finite size and shape. The polymeric film comprises a composition having at least 25% by weight of a wax material, an enthalpy of fusion of at least about 100 J/g, and an elongation value at break of at least about 100%. Any type of hot melt adhesive formulation can be packaged or surrounded by the polymeric film in the process.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: August 11, 2009
    Inventors: Atul Mehta, Michael A. Neperud, Nicolas E. Sajot, Dominique Chiarabini, Chrisophe Morel-Fourrier
  • Process for packaging plastic materials like hot melt adhesives
    Patent number: 7328547
    Abstract: A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging hot melt adhesives, the resulting package formed thereby, and the film composition used therein. The method is preferably a coextrusion process for packaging a pressure sensitive hot melt adhesive by extruding a hot melt adhesive through a die orifice, and coextruding a wax-based polymeric film to surround the hot melt adhesive. The coated adhesive may then be formed into individual packaged units having a finite size and shape. The polymeric film comprises a composition having at least 25% by weight of a wax material, an enthalpy of fusion of at least about 100 J/g, and an elongation value at break of at least about 100%. Any type of hot melt adhesive formulation can be packaged or surrounded by the polymeric film in the process.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: February 12, 2008
    Assignee: Bostik, Inc.
    Inventors: Atul Mehta, Michael A. Neperud, Nicolas E. Sajot, Dominique Chiarabini, Chrisophe Morel-Fourrier