Patents by Inventor Nicolas J. Colella

Nicolas J. Colella has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for electrically interconnecting electrodes
    Patent number: 6402881
    Abstract: Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb—Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb—Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: June 11, 2002
    Assignee: The Regents of the University of California
    Inventors: Paul G. Carey, Jesse B. Thompson, Nicolas J. Colella, Kenneth A. Williams
  • Solar cell array interconnects
    Patent number: 5466302
    Abstract: Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: November 14, 1995
    Assignee: Regents of the University of California
    Inventors: Paul G. Carey, Jesse B. Thompson, Nicolas J. Colella, Kenneth A. Williams