Patents by Inventor Nicolas Mauricio WEISS

Nicolas Mauricio WEISS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11604419
    Abstract: Methods of determining information about a patterning process. In a method, measurement data from a metrology process applied to each of a plurality of metrology targets on a substrate is obtained. The measurement data for each metrology target includes at least a first contribution and a second contribution. The first contribution is from a parameter of interest of a patterning process used to form the metrology target. The second contribution is from an error in the metrology process. The method further includes using the obtained measurement data from all of the plurality of metrology targets to obtain information about an error in the metrology process, and using the obtained information about the error in the metrology process to extract a value of the parameter of interest for each metrology target.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 14, 2023
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Joannes Jitse Venselaar, Anagnostis Tsiatmas, Samee Ur Rehman, Paul Christiaan Hinnen, Jean-Pierre Agnes Henricus Marie Vaessen, Nicolas Mauricio Weiss, Gonzalo Roberto Sanguinetti, Thomai Zacharopoulou, Martijn Maria Zaal
  • Publication number: 20210255552
    Abstract: Methods of determining information about a patterning process. In a method, measurement data from a metrology process applied to each of a plurality of metrology targets on a substrate is obtained. The measurement data for each metrology target includes at least a first contribution and a second contribution. The first contribution is from a parameter of interest of a patterning process used to form the metrology target. The second contribution is from an error in the metrology process. The method further includes using the obtained measurement data from all of the plurality of metrology targets to obtain information about an error in the metrology process, and using the obtained information about the error in the metrology process to extract a value of the parameter of interest for each metrology target.
    Type: Application
    Filed: April 27, 2021
    Publication date: August 19, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Joannes Jitse VENSELAAR, Anagnostis TSIATMAS, Samee Ur REHMAN, Paul Christiaan HINNEN, Jean-Pierre Agnes Henricus Marie VAESSEN, Nicolas Mauricio WEISS, Gonzalo Roberto SANGUINETTI, Thomai ZACHAROPOULOU, Martijn Maria ZAAL
  • Patent number: 11022897
    Abstract: Methods of determining information about a patterning process. In a method, measurement data from a metrology process applied to each of a plurality of metrology targets on a substrate is obtained. The measurement data for each metrology target includes at least a first contribution and a second contribution. The first contribution is from a parameter of interest of a patterning process used to form the metrology target. The second contribution is from an error in the metrology process. The method further includes using the obtained measurement data from all of the plurality of metrology targets to obtain information about an error in the metrology process, and using the obtained information about the error in the metrology process to extract a value of the parameter of interest for each metrology target.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: June 1, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Joannes Jitse Venselaar, Anagnostis Tsiatmas, Samee Ur Rehman, Paul Christiaan Hinnen, Jean-Pierre Agnes Henricus Marie Vaessen, Nicolas Mauricio Weiss, Gonzalo Roberto Sanguinetti, Thomai Zacharopoulou, Martijn Maria Zaal
  • Patent number: 10705430
    Abstract: A method of measuring a parameter of interest relating to a structure formed by a process on a substrate, and associated apparatuses. The method includes measuring the structure with measurement radiation including a first illumination acquisition setting (determining one or more selected from: a wavelength, a polarization or an incident angle of the measurement radiation) to obtain a first measurement value for the structure. The method further includes estimating, by applying a correction model to the first measurement value, at least a second measurement value for the structure corresponding to measurement of the structure with a second illumination acquisition setting different from the first illumination acquisition setting.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: July 7, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Gonzalo Roberto Sanguinetti, Nicolas Mauricio Weiss, Jean-Pierre Agnes Henricus Marie Vaessen
  • Publication number: 20190171115
    Abstract: Methods of determining information about a patterning process. In a method, measurement data from a metrology process applied to each of a plurality of metrology targets on a substrate is obtained. The measurement data for each metrology target includes at least a first contribution and a second contribution. The first contribution is from a parameter of interest of a patterning process used to form the metrology target. The second contribution is from an error in the metrology process. The method further includes using the obtained measurement data from all of the plurality of metrology targets to obtain information about an error in the metrology process, and using the obtained information about the error in the metrology process to extract a value of the parameter of interest for each metrology target.
    Type: Application
    Filed: November 19, 2018
    Publication date: June 6, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Joannes Jitse VENSELAAR, Anagnostis Tsiatmas, Samee Ur Rehman, Paul Christiaan Hinnen, Jean-Pierre Agnes Henricus Marie Vaessen, Nicolas Mauricio Weiss, Gonzalo Roberto Sanguinetti, Thomai Zacharopoulou, Martijn Maria Zaal
  • Publication number: 20180341182
    Abstract: A method of measuring a parameter of interest relating to a structure formed by a process on a substrate, and associated apparatuses. The method includes measuring the structure with measurement radiation including a first illumination acquisition setting (determining one or more selected from: a wavelength, a polarization or an incident angle of the measurement radiation) to obtain a first measurement value for the structure. The method further includes estimating, by applying a correction model to the first measurement value, at least a second measurement value for the structure corresponding to measurement of the structure with a second illumination acquisition setting different from the first illumination acquisition setting.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 29, 2018
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Gonzalo Roberto SANGUINETTI, Nicolas Mauricio WEISS, Jean-Pierre Agnes Henricus Marie VAESSEN