Patents by Inventor Nicolas Merlette

Nicolas Merlette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110303503
    Abstract: The invention relates to a device (100, 110) for reducing vibrations and/or oscillations in flat components (201, 202) of vehicles, comprising a carrier (101, 111), a damping means (102, 112) disposed on the carrier (101, 111) for reducing the vibrations and/or oscillations, wherein a plurality of damping means (102, 112) are provided on the carrier (101, 111) in order to capture a plurality of vibration and/or oscillation zones of the flat components (201, 202).
    Type: Application
    Filed: August 24, 2011
    Publication date: December 15, 2011
    Inventor: Nicolas Merlette
  • Publication number: 20100314813
    Abstract: A thermally expandable material comprising a first thermoplastic elastomer having a first glass transition temperature, a second thermoplastic elastomer having a second glass transition temperature, wherein the first and the second glass transition temperature differ by at least 10° C.; at least one thermoplastic polymer selected from the group consisting of polymers and copolymers with at least one polymerizable C?C double bond, optionally at least one tackifying resin, at least one latent chemical blowing agent in an amount effective to cause the expandable material to expand at least 50% in volume when heated.
    Type: Application
    Filed: March 17, 2010
    Publication date: December 16, 2010
    Applicant: HENKEL AG & CO.KGaA
    Inventors: Jean-Luc Wojtowicki, Delphine Leclerc, Nicolas Merlette
  • Publication number: 20090233069
    Abstract: The invention discloses a dissipative vibration damping device (1), comprising a carrier (2) having an inner surface and an outer surface, the carrier being comprising on at least one surface thereof a bonding layer (3), wherein the carrier (2) is dissipative and has a damping loss factor of at least 0.2 and wherein the bonding layer (3) is made of a rigid material with higher stiffness than the carrier (2). Also disclosed is a system and a method using such dissipative damping device.
    Type: Application
    Filed: February 3, 2009
    Publication date: September 17, 2009
    Applicant: Henkel AG & Co. KGaA
    Inventors: Nicolas Merlette, Philippe Belle