Abstract: A process for the deposition of a coating on at least a part of a metallic substrate, a) mixing a liquid and a powder having particles of a metallic material to be deposited and particles of a pickling agent, so as to prepare a suspension, b) application of the suspension prepared in step a) to at least a part of the surfaces of the metallic substrate, so as to obtain a substrate-suspension assembly, c) carrying out a heat treatment of the assembly which includes heating at a first temperature of at least 500° C. and heating at a second temperature greater than the first temperature, and d) recovery of a substrate coated, at least in part, with a coating, the pickling agent being a halogenated compound and the suspension having from 10% to 60% of the pickling agent, with respect to the total weight of the powder.

Abstract: A process for the deposition of a coating on at least a part of a metallic substrate, a) mixing a liquid and a powder having particles of a metallic material to be deposited and particles of a pickling agent, so as to prepare a suspension, b) application of the suspension prepared in step a) to at least a part of the surfaces of the metallic substrate, so as to obtain a substrate-suspension assembly, c) carrying out a heat treatment of the assembly which includes heating at a first temperature of at least 500° C. and heating at a second temperature greater than the first temperature, and d) recovery of a substrate coated, at least in part, with a coating, the pickling agent being a halogenated compound and the suspension having from 10% to 60% of the pickling agent, with respect to the total weight of the powder.

Abstract: A method for depositing an electrically conductive metal onto at least one portion of the inner surface (3) of an internal cavity (2) of a waveguide (1) includes: preparing a suspension containing at least one liquid and at least one precursor of the electrically conductive metal in suspension in said at least one liquid; coating at least one portion of the inner surface (3) of the internal cavity (2) of the waveguide (1) with the suspension, and heat-treating at least said portion of the inner surface (3) of the internal cavity (2) of the waveguide (1) coated with the suspension. A method for manufacturing a metallized waveguide can implement this deposition method.

Abstract: A method for depositing an electrically conductive metal onto at least one portion of the inner surface (3) of an internal cavity (2) of a waveguide (1) includes: preparing a suspension containing at least one liquid and at least one precursor of the electrically conductive metal in suspension in said at least one liquid; coating at least one portion of the inner surface (3) of the internal cavity (2) of the waveguide (1) with the suspension, and heat-treating at least said portion of the inner surface (3) of the internal cavity (2) of the waveguide (1) coated with the suspension. A method for manufacturing a metallized waveguide can implement this deposition method.

Abstract: Process for depositing a corrosion-protection coating on at least one portion of the surfaces of a metallic substrate having at least one cavity with an equivalent diameter emm<2 mm and a length/width ratio of greater than 150, using an aqueous suspension comprising powder of the metal to be deposited on the substrate combined with an agent for protecting the surface of the metal powder, a diluent, and at least one additive, the particles of the suspension each having an equivalent diameter d such that d?emm/10.

Abstract: Process for depositing a corrosion-protection coating on at least one portion of the surfaces of a metallic substrate having at least one cavity with an equivalent diameter emm<2 mm and a length/width ratio of greater than 150, using an aqueous suspension comprising powder of the metal to be deposited on the substrate combined with an agent for protecting the surface of the metal powder, a diluent, and at least one additive, the particles of the suspension each having an equivalent diameter d such that d?emm/10.