Abstract: The invention relates to a method for cross-linking a cross-linkable adhesive composition without solvent on a film, comprising driving and/or guiding said film in a climatic chamber, by a Caroll-type drive or guide. The invention also relates to a climatic chamber comprising a Caroll-type drive or guide. The invention also relates to a process for manufacturing a self-adhesive article comprising at least a substrate and an adhesive layer, said process comprising the steps of: a) conditioning an adhesive composition at a temperature of between 20 and 160° C.; b) coating the adhesive composition b1) onto at least a part of the substrate or b2) onto a non-sticking support; submitting the article obtained at step b) to a controlled atmosphere. The invention also relates to self-adhesive articles having high coating weights and to processes for bonding them.

Abstract: A hot-melt pressure-sensitive adhesive (HMPSA) composition comprising (a) 25 to 50% of one or more styrene block copolymers SBS, SIS, SIBS, SEBS or SEPS; (b) 35 to 75% of one or more compatible tackifying resins that are liquid or have a softening temperature below 150° C.; and (c) 1 to 20% of one or more supramolecular polymers obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone and a fatty acid composition comprising 51 to 100% of one or more dimers and/or trimers of fatty acids and 0 to 49% of one or more monomers of fatty acids. A multilayer system including the HMPSA, an adjacent printable support layer, made of paper or a polymer film, and a protective layer adjacent is also provided. The multilayer system may be used in a self-adhesive label.

Abstract: The invention relates to a method for cross-linking a cross-linkable adhesive composition without solvent on a film, comprising driving and/or guiding said film in a climatic chamber, by a Caroll-type drive or guide. The invention also relates to a climatic chamber comprising a Caroll-type drive or guide. The invention also relates to a process for manufacturing a self-adhesive article comprising at least a substrate and an adhesive layer, said process comprising the steps of: a) conditioning an adhesive composition at a temperature of between 20 and 160° C.; b) coating the adhesive composition b1) onto at least a part of the substrate or b2) onto a non-sticking support; submitting the article obtained at step b) to a controlled atmosphere. The invention also relates to self-adhesive articles having high coating weights and to processes for bonding them.

Abstract: A hot-melt pressure-sensitive adhesive (HMPSA) composition is provided including a) 25 to 50% of a styrene block copolymer chosen from SIS, SIBS, SEBS or SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which comprises 6 to 54 carbon atoms. A multilayer system including the HMPSA layer, a printable support layer and an adjacent protective layer is also provided. Corresponding self-adhesive label and process for recycling a labeled article, with debonding of said label by immersing the article in a hot basic aqueous solution is also provided.

Abstract: 1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: —from 51 to 100% of one or more dimers and/or trimers of fatty acids; and—from 0 to 49% of one or more monomers of fatty acids. 2) Use of said composition with a view to manufacturing disposable hygiene articles.

Abstract: The present invention relates to hot-coextrudable hot-melt pressure-sensitive adhesives particularly suitable for the production of multilayer films intended for what are called “repositionable” packages that are opened and reclosed easily. The films used in these packages comprise at least three layers, namely an outer layer intended to be complexed thereafter, a sealing and separable layer, defining all or part of the internal surface of the package, and between them a hot-melt adhesive layer that joins them together. In this type of package, the adhesive plays an essential role insofar as, once the package has been opened by the end user, the quality of the reclosure and of the reopening will depend on the performance of the adhesive, which is of course a pressure-sensitive adhesive, that is to say an adhesive that adheres simply by manual pressure.

Abstract: The invention relates to a method of gluing substrates which are hydrophobic and oleophobic as a result of having been treated earlier using a fluorinated compound, said substrates being intended for packaging. The inventive method consists in applying an adhesive to at least one of the substrates, said adhesive comprising: a) 5 to 50 weight percent of at least one styrenic block copolymer (preferably, 15 to 30%); b) 20 to 60 weight percent of at least one tackifying resin which is compatible with the non-styrene phase (preferably, 35 to 55%); c) 0 to 20 weight percent of at least one tackifying resin which is compatible with the styrene phase and, (preferably, 5 to 15%); d) 5 to 25 weight percent of at least one thermofusible wax (preferably, 10 to 17%); e) 3 to 20 weight percent of liquid plasticisers which are normally used in thermofusible adhesives; and/or f) additives. In this way, said mixture presents the following characteristics: (i) a viscosity of between 400 and 3000 mPa·s at 170° C.

Abstract: A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging hot melt adhesives, the resulting package formed thereby, and the film composition used therein. The method is preferably a coextrusion process for packaging a pressure sensitive hot melt adhesive by extruding a hot melt adhesive through a die orifice, and coextruding a wax-based polymeric film to surround the hot melt adhesive. The coated adhesive may then be formed into individual packaged units having a finite size and shape. The polymeric film comprises a composition having at least 25% by weight of a wax material, an enthalpy of fusion of at least about 100J/g, and an elongation value at break of at least about 100%. Any type of hot melt adhesive formulation can be packaged or surrounded by the polymeric film in the process.

Abstract: A hot melt adhesive composition, comprising a blend of components including about 10% to about 40% by weight of an elastomeric block copolymer, preferably styrene-isoprene-styrene (SIS) or styrene-butadiene-styrene (SBS), about 15% to about 70% by weight of a first midblock tackifying resin having a softening point of at least about 110° C. and having an aromatic content of at least about 1.5% by weight; about 0 to 55% of second midblock tackifying resin, about 5% to about 35% by weight of a plasticizer; and about 0% to about 20% by weight of an end block resin having a softening point lower than 125° C.; wherein the components total 100% by weight of the composition, the viscosity of the composition is equal to or less than about 20,000 mPa.s at 120° C., and is applied at a temperature lower that 150° C. and initial bond retention of the composition on elastic strands is at least about 60%.

Abstract: A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging hot melt adhesives, the resulting package formed thereby, and the film composition used therein. The method is preferably a coextrusion process for packaging a pressure sensitive hot melt adhesive by extruding a hot melt adhesive through a die orifice, and coextruding a wax-based polymeric film to surround the hot melt adhesive. The coated adhesive may then be formed into individual packaged units having a finite size and shape. The polymeric film comprises a composition having at least 25% by weight of a wax material, an enthalpy of fusion of at least about 100 J/g, and an elongation value at break of at least about 100%. Any type of hot melt adhesive formulation can be packaged or surrounded by the polymeric film in the process.

Abstract: The invention relates to a method of gluing substrates which are hydrophobic and oleophobic as a result of having been treated earlier using a fluorinated compound, said substrates being intended for packaging. The inventive method consists in applying an adhesive to at least one of the substrates, said adhesive comprising: a) 5 to 50 weight percent of at least one styrenic block copolymer (preferably, 15 to 30%); b) 20 to 60 weight percent of at least one tackifying resin which is compatible with the non-styrene phase (preferably, 35 to 55%); c) 0 to 20 weight percent of at least one tackifying resin which is compatible with the styrene phase and, (preferably, 5 to 15%); d) 5 to 25 weight percent of at least one thermofusible wax (preferably, 10 to 17%); e) 3 to 20 weight percent of liquid plasticisers which are normally used in thermofusible adhesives; and/or f) additives. In this way, said mixture presents the following characteristics: (i) a viscosity of between 400 and 3000 mPa.s at 170° C.

Abstract: The present invention relates to hot-coextrudable hot-melt pressure-sensitive adhesives particularly suitable for the production of multilayer films intended for what are called “repositionable” packages that are opened and reclosed easily. The films used in these packages comprise at least three layers, namely an outer layer intended to be complexed thereafter, a sealing and separable layer, defining all or part of the internal surface of the package, and between them a hot-melt adhesive layer that joins them together. In this type of package, the adhesive plays an essential role insofar as, once the package has been opened by the end user, the quality of the reclosure and of the reopening will depend on the performance of the adhesive, which is of course a pressure-sensitive adhesive, that is to say an adhesive that adheres simply by manual pressure.