Abstract: An apparatus for subdividing a sheet of brittle insulating material with a plurality of semiconductor chips disposed thereon. The chips are separated by row and column kerfs each of which contains a respective scribed line. The subdivision of the sheet is accomplished by placing the sheet in a flexible conformable carrier having an open grid, formed of ribs, with each rib positioned over a respective scribe line on the surface of the sheet and forcing the sheet against an arched anvil, thereby fracturing the sheet along the scribe lines.

Abstract: A stencil printing method and apparatus for printing paste material in a given pattern on a substrate from a paste dispenser through a stencil to define the stencil pattern on a substrate. The apparatus is provided with a cleaning module that can be moved against the printing face of the stencil and moved, along a given path beneath the stencil, for cleaning the printing face of the stencil. The cleaning module includes a blade assembly mounted there on transverse to the path of movement of the cleaning module. The print apparatus further including selectively operable means for actuating the blade assembly during a select cleaning cycle to engage the leading end of its blade with the underside of the stencil as the cleaning module is passed beneath said stencil whereby the leading edge of the blade scrapes debris from the underside of said stencil.

Abstract: A method and an apparatus for subdividing a sheet of brittle insulating material (a silicon wafer substrate) with a plurality of semiconductor chips disposed thereon and electrically bonded to respective underlying circuit blocks printed on the sheet to provide each chip with its own substrate. The chips are arranged in rows and columns separated by row and column kerfs each of which contains a respective scribed line.