Abstract: A device is described for generating a control signal for controlling a passenger protection arrangement of a motor vehicle, having a first acceleration sensor for generating a first acceleration signal, having a second acceleration sensor for generating a second acceleration signal, having a first structure-borne noise sensor for generating a first structure-borne noise signal, having a second structure-borne noise sensor for generating a second structure-borne noise signal, and having an evaluation circuit, the evaluation circuit (being configured for generating a combination signal from the first structure-borne noise signal and the second structure-borne noise signal, the evaluation circuit being configured for generating the control signal as a function of the first acceleration signal, the second acceleration signal and the combination signal.

Abstract: A micromechanical sensor element for detecting lateral acceleration, having at least two boundaries situated essentially orthogonally with respect to one another, and also having at least one spring element, in which the spring element is oriented at an angle relative to at least one of the boundaries.

Abstract: A thermopile sensor for detection of infrared radiation in a measurement wavelength range having a sensor substrate in which a cavity is formed, a diaphragm formed on the sensor substrate above the cavity, at least one thermopile structure formed in, on, or below the diaphragm, having at least one thermopile pair of mutually contacted thermopile legs, where the two thermopile legs are made of doped semiconductor materials having different Seebeck coefficients, and at least one insulating intermediate layer formed between the thermopile legs. A layer system having at least the two thermopile legs and at least the insulating intermediate layer is formed above the lower cavity and has multibeam interference for IR radiation in the measurement wavelength range, absorbing a portion of the IR radiation and at least partially reducing the reflection.

Abstract: A sensor for detecting electromagnetic radiation, having a detection element; and at least one electrode; the detection element and the at least one electrode forming a variable capacitor, and a change in the capacitance of the capacitor being caused by the detected electromagnetic radiation.

Abstract: A device is described for generating a control signal for controlling a passenger protection arrangement of a motor vehicle, having a first acceleration sensor for generating a first acceleration signal, having a second acceleration sensor for generating a second acceleration signal, having a first structure-borne noise sensor for generating a first structure-borne noise signal, having a second structure-borne noise sensor for generating a second structure-borne noise signal, and having an evaluation circuit, the evaluation circuit (being configured for generating a combination signal from the first structure-borne noise signal and the second structure-borne noise signal, the evaluation circuit being configured for generating the control signal as a function of the first acceleration signal, the second acceleration signal and the combination signal.

Abstract: A sensor system, in particular an acceleration sensor system, includes a sensor element and a cover element, at least one side of the sensor element having a covering provided by the cover element, and the cover element being at least partially designed as an infrared-protection element.

Abstract: A sensor for detecting electromagnetic radiation, having a detection element; and at least one electrode; the detection element and the at least one electrode forming a variable capacitor, and a change in the capacitance of the capacitor being caused by the detected electromagnetic radiation.

Abstract: A thermopile sensor for detection of infrared radiation in a measurement wavelength range having a sensor substrate in which a cavity is formed, a diaphragm formed on the sensor substrate above the cavity, at least one thermopile structure formed in, on, or below the diaphragm, having at least one thermopile pair of mutually contacted thermopile legs, where the two thermopile legs are made of doped semiconductor materials having different Seebeck coefficients, and at least one insulating intermediate layer formed between the thermopile legs. A layer system having at least the two thermopile legs and at least the insulating intermediate layer is formed above the lower cavity and has multibeam interference for IR radiation in the measurement wavelength range, absorbing a portion of the IR radiation and at least partially reducing the reflection.

Abstract: A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. the cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. the electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.

Abstract: A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. The cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. The electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.