Patents by Inventor Nicole A. Butel

Nicole A. Butel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE WITH SURFACE MODIFIED LIQUID METAL SPHERES AND METHOD OF MAKING
    Publication number: 20230034217
    Abstract: An integrated circuit (IC) package includes a one or more die, a package substrate, a thermal interface material, and a cover. The cover is disposed over or above the one or more die. The thermal interface material includes a surface modified metal and a silicon monomer.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Applicant: Avago Technologies International Sales Pte. Limited
    Inventors: Mayank Mayukh, Shrikara Prabhu Tendel, Sam Karikalan, Nicole A. Butel
  • CIRCUIT PACKAGE WITH INTEGRATED DIRECT-CURRENT (DC) BLOCKING CAPACITOR
    Publication number: 20110011634
    Abstract: A circuit package includes a substrate formed using a plurality of layers, the substrate having a first surface and a second surface, at least some of the plurality of layers being electrically interconnected by a via; and at least one standard surface-mount capacitive element electrically coupled to at least one surface of the substrate, thereby allowing electrical and mechanical access to the first surface and the second surface, the at least one standard surface-mount capacitive element located to prevent the passage of a direct current (DC) signal through the circuit package.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 20, 2011
    Applicant: Avago Technologies Enterprise IP (Singapore )Pte. Ltd.
    Inventors: Peter Moldauer, Nicole A. Butel, Brian James Misek
  • Methods for providing an integrated circuit package with an alignment mechanism
    Patent number: 6872592
    Abstract: An integrated circuit package is provided with an alignment mechanism by 1) heating a wetting media that has been applied to a number of annular ring shaped alignment pads provided on the integrated circuit package, at known locations with respect to a pattern of contacts pads that is provided on the integrated circuit package, and then 2) while the wetting media is heated, attaching a number of alignment balls or alignment bullets to the annular ring shaped alignment pads.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: March 29, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Gerald J. D'Amato, Sari K. Christensen, Nicole Butel
  • Methods for providing an integrated circuit package with an alignment mechanism
    Publication number: 20040089880
    Abstract: An integrated circuit package is provided with an alignment mechanism by 1) heating a wetting media that has been applied to a number of annular ring shaped alignment pads provided on the integrated circuit package, at known locations with respect to a pattern of contacts pads that is provided on the integrated circuit package, and then 2) while the wetting media is heated, attaching a number of alignment balls or alignment bullets to the annular ring shaped alignment pads.
    Type: Application
    Filed: October 30, 2003
    Publication date: May 13, 2004
    Inventors: Gerald J. D'Amato, Sari K. Christensen, Nicole Butel
  • Apparatus for aligning an integrated circuit package with an interface
    Patent number: 6724095
    Abstract: An integrated circuit package is provided with alignment pads which are solid or annular ring shaped. Alignment members such as balls or bullets are attached to the alignment pads via a wetting media. When heated, the wetting media serves to center and seat the alignment members on the alignment pads. When cooled, the wetting media serves to bond the alignment members to the alignment pads.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: April 20, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Gerald J. D'Amato, Sari K. Christensen, Nicole Butel
  • Methods and apparatus for aligning an integrated circuit package with an interface
    Publication number: 20030020179
    Abstract: An integrated circuit package is provided with alignment pads which are solid or annular ring shaped. Alignment members such as balls or bullets are attached to the alignment pads via a wetting media. When heated, the wetting media serves to center and seat the alignment members on the alignment pads. When cooled, the wetting media serves to bond the alignment members to the alignment pads.
    Type: Application
    Filed: July 25, 2001
    Publication date: January 30, 2003
    Inventors: Gerald J. D'Amato, Sari K. Christensen, Nicole Butel