Abstract: Disclosed is a method for lithographically producing a target structure on a non-planar initial structure by exposing a photoresist by means of a lithography beam. In the inventive method, the topography of a surface of the non-planar initial structure is detected. A test parameter for the lithography beam is used and an interaction of the lithography beam with the initial structure and the resultant change in the lithography beam and/or the target structure to be produced are determined. A correction parameter for the lithography beam is determined such that the change in the lithography beam and/or the target structure to be produced that is caused by the interaction of the lithography beam with the initial structure is reduced. The desired target structure on the initial structure is produced by exposing the photoresist by means of the lithography beam using the correction parameter.

Abstract: Method (and apparatus) for producing a 3D target structure in lithographic material. Focus region of a laser writing beam travels through a scanning manifold through the lithographic material. In the focus region of the laser writing beam, an exposure dose is irradiated into the lithographic material, and a structure region is locally defined. At least one exposure data set which represents a local exposure dose for the scan manifold as a function of location is determined. A structure which approximates the target structure is defined based on at least one exposure data set. This structure is analyzed and at least one analysis data set which represents the analyzed structure is determined. Deviation data set which represents deviations of the already defined structure from the target structure is determined. At least one correction exposure data set is determined. Correction structure based on the at least one correction exposure data set is defined.

Abstract: Disclosed is a method for lithographically producing a target structure on a non-planar initial structure by exposing a photoresist by means of a lithography beam. In the inventive method, the topography of a surface of the non-planar initial structure is detected. A test parameter for the lithography beam is used and an interaction of the lithography beam with the initial structure and the resultant change in the lithography beam and/or the target structure to be produced are determined. A correction parameter for the lithography beam is determined such that the change in the lithography beam and/or the target structure to be produced that is caused by the interaction of the lithography beam with the initial structure is reduced. The desired target structure on the initial structure is produced by exposing the photoresist by means of the lithography beam using the correction parameter.

Abstract: A system, computer program product and method for producing a three-dimensional overall structure by means of laser lithography, the overall structure being approximated by at least one partial structure, wherein, for the purposes of writing the partial structure, an exposure dose is radiated into the lithography material in a focal region of a laser writing beam while exploiting multi-photon absorption. Here, in the partial structure, the exposure dose in those edge portions that immediately adjoin an external surface of the overall structure to be produced is modified in comparison with the remaining partial structure.

Abstract: Disclosed is a method for lithographically producing a target structure on a non-planar initial structure by exposing a photoresist by means of a lithography beam. In the inventive method, the topography of a surface of the non-planar initial structure is detected. A test parameter for the lithography beam is used and an interaction of the lithography beam with the initial structure and the resultant change in the lithography beam and/or the target structure to be produced are determined. A correction parameter for the lithography beam is determined such that the change in the lithography beam and/or the target structure to be produced that is caused by the interaction of the lithography beam with the initial structure is reduced. The desired target structure on the initial structure is produced by exposing the photoresist by means of the lithography beam using the correction parameter.

Abstract: A system, computer program product and method for producing a three-dimensional overall structure by means of laser lithography, the overall structure being approximated by at least one partial structure, wherein, for the purposes of writing the partial structure, an exposure dose is radiated into the lithography material in a focal region of a laser writing beam while exploiting multi-photon absorption. Here, in the partial structure, the exposure dose in those edge portions that immediately adjoin an external surface of the overall structure to be produced is modified in comparison with the remaining partial structure.

Abstract: The present invention provides a process for producing an optical waveguide (20) more particularly for integrated photonic systems. This process comprises provision of polymerizable material; local polymerization of the polymerizable material to produce a multiplicity of polymerized structural elements (14); removal of the unpolymerized regions of the polymerizable material; and heating of the polymerized material more particularly above the glass transition temperature thereof in order to fuse the multiplicity of polymerized structural elements (14) together to form the optical waveguide (20).

Abstract: Disclosed is a method for lithographically producing a target structure on a non-planar initial structure by exposing a photoresist by means of a lithography beam. In the inventive method, the topography of a surface of the non-planar initial structure is detected. A test parameter for the lithography beam is used and an interaction of the lithography beam with the initial structure and the resultant change in the lithography beam and/or the target structure to be produced are determined. A correction parameter for the lithography beam is determined such that the change in the lithography beam and/or the target structure to be produced that is caused by the interaction of the lithography beam with the initial structure is reduced. The desired target structure on the initial structure is produced by exposing the photoresist by means of the lithography beam using the correction parameter.

Abstract: The present invention provides a process for producing an optical waveguide (20) more particularly for integrated photonic systems. This process comprises provision of polymerizable material; local polymerization of the polymerizable material to produce a multiplicity of polymerized structural elements (14); removal of the unpolymerized regions of the polymerizable material; and heating of the polymerized material more particularly above the glass transition temperature thereof in order to fuse the multiplicity of polymerized structural elements (14) together to form the optical waveguide (20).

Abstract: A method for making optical connections with optical waveguides includes mounting the optical waveguides or a device comprising the optical waveguides, on a component carrier. A partial region of the optical waveguides is embedded in a volume of resist material. Positions of the optical waveguides to be connected are detected with reference to a coordinate system using a measuring system. Favorable, three-dimensional geometries are determined for optical waveguide structures for connecting the optical waveguides to each other at predetermined connecting locations and the optical waveguide structure geometries are converted to a machine-readable dataset. The optical waveguide geometries in the volume of the resist material are three-dimensionally structured using a direct-writing lithography device operating on the basis of the machine-readable dataset.

Abstract: An optical arrangement includes a plurality of planar substrates with at least one planar integrated optical waveguide on each planar substrate. At least one optical waveguide structure has at least one end connected via an optical connecting structure to one of the planar integrated optical waveguides. The optical waveguide structure is positioned at least partly outside the integration plane for the planar integrated optical waveguide and a refractive index contrast between a core region and a cladding region of the optical waveguide structure is at least 0.01.

Abstract: An optical arrangement includes a plurality of planar substrates with at least one planar integrated optical waveguide on each planar substrate. At least one optical waveguide structure has at least one end connected via an optical connecting structure to one of the planar integrated optical waveguides. The optical waveguide structure is positioned at least partly outside the integration plane for the planar integrated optical waveguide and a refractive index contrast between a core region and a cladding region of the optical waveguide structure is at least 0.01.

Abstract: A method for making optical connections with optical waveguides includes mounting the optical waveguides or a device comprising the optical waveguides, on a component carrier. A partial region of the optical waveguides is embedded in a volume of resist material. Positions of the optical waveguides to be connected are detected with reference to a coordinate system using a measuring system. Favorable, three-dimensional geometries are determined for optical waveguide structures for connecting the optical waveguides to each other at predetermined connecting locations and the optical waveguide structure geometries are converted to a machine-readable dataset. The optical waveguide geometries in the volume of the resist material are three-dimensionally structured using a direct-writing lithography device operating on the basis of the machine-readable dataset.