Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.

Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.

Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.

Abstract: Cleat structures, e.g., for golf shoes, may include a flat and flexible interior surface and/or a generally disk-shaped perimeter area that includes features to promote in-molding of the cleat to a footwear sole component (e.g., to permanently engage the cleat with an outsole member). Such cleats may provide a flexible and comfortable base, including a low profile, e.g., to enable formation relatively thin and/or flexible footwear sole components. Footwear sole components and articles of footwear that include one or more in-molded cleat structures of this type also are described. Molds used for in-molding procedures and methods of using the molds to make articles with in-molded components (e.g., for making footwear sole structures including one or more in-molded cleats) also are described.

Abstract: An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.

Abstract: Cleat structures, e.g., for golf shoes, may include a flat and flexible interior surface and/or a generally disk-shaped perimeter area that includes features to promote in-molding of the cleat to a footwear sole component (e.g., to permanently engage the cleat with an outsole member). Such cleats may provide a flexible and comfortable base, including a low profile, e.g., to enable formation relatively thin and/or flexible footwear sole components. Footwear sole components and articles of footwear that include one or more in-molded cleat structures of this type also are described. Molds used for in-molding procedures and methods of using the molds to make articles with in-molded components (e.g., for making footwear sole structures including one or more in-molded cleats) also are described.

Abstract: An article of footwear with a detachable wrap is disclosed. The detachable wrap removably attaches to a lacing area of an upper and extends under the article of footwear through a channel in a midsole of the sole structure. The detachable wrap may change the appearance of the article of footwear and additionally provide support to a foot of the wearer.

Abstract: Cleat structures, e.g., for golf shoes, may include a flat and flexible interior surface and/or a generally disk-shaped perimeter area that includes features to promote in-molding of the cleat to a footwear sole component (e.g., to permanently engage the cleat with an outsole member). Such cleats may provide a flexible and comfortable base, including a low profile, e.g., to enable formation relatively thin and/or flexible footwear sole components. Footwear sole components and articles of footwear that include one or more in-molded cleat structures of this type also are described. Molds used for in-molding procedures and methods of using the molds to make articles with in-molded components (e.g., for making footwear sole structures including one or more in-molded cleats) also are described.

Abstract: Cleat structures, e.g., for golf shoes, may include a flat and flexible interior surface and/or a generally disk-shaped perimeter area that includes features to promote in-molding of the cleat to a footwear sole component (e.g., to permanently engage the cleat with an outsole member). Such cleats may provide a flexible and comfortable base, including a low profile, e.g., to enable formation relatively thin and/or flexible footwear sole components. Footwear sole components and articles of footwear that include one or more in-molded cleat structures of this type also are described. Molds used for in-molding procedures and methods of using the molds to make articles with in-molded components (e.g., for making footwear sole structures including one or more in-molded cleats) also are described.

Abstract: Cleat structures, e.g., for golf shoes, may include a flat and flexible interior surface and/or a generally disk-shaped perimeter area that includes features to promote in-molding of the cleat to a footwear sole component (e.g., to permanently engage the cleat with an outsole member). Such cleats may provide a flexible and comfortable base, including a low profile, e.g., to enable formation relatively thin and/or flexible footwear sole components. Footwear sole components and articles of footwear that include one or more in-molded cleat structures of this type also are described. Molds used for in-molding procedures and methods of using the molds to make articles with in-molded components (e.g., for making footwear sole structures including one or more in-molded cleats) also are described.

Abstract: An article of footwear with a detachable wrap is disclosed. The detachable wrap removably attaches to a lacing area of an upper and extends under the article of footwear through a channel in a midsole of the sole structure. The detachable wrap may change the appearance of the article of footwear and additionally provide support to a foot of the wearer.

Abstract: An article of footwear with a detachable wrap is disclosed. The detachable wrap removably attaches to a lacing area of an upper and extends under the article of footwear through a channel in a midsole of the sole structure. The detachable wrap may change the appearance of the article of footwear and additionally provide support to a foot of the wearer.