Patents by Inventor Nicole S. Mueller

Nicole S. Mueller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for forming multi-layered vias in sequentially fabricated circuits
    Patent number: 10453787
    Abstract: An electronic module assembly including a via spanning multiple layers in a wafer based module is described. The electronic module assembly can include a first layer deposited upon a substrate, a second layer deposited on a top surface of the first layer, and the via spanning multiple layers. The via can include a first bottom that is formed on a top surface of the first layer and a first sidewall that upstands from the first bottom and extending at least through the second layer.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: October 22, 2019
    Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventors: Maurice S. Karpman, Nicole S. Mueller, Gary B. Tepolt, Russell Berman
  • METHOD AND APPARATUS FOR FORMING MULTI-LAYERED VIAS IN SEQUENTIALLY FABRICATED CIRCUITS
    Publication number: 20160343652
    Abstract: An electronic module assembly including a via spanning multiple layers in a wafer based module is described. The electronic module assembly can include a first layer deposited upon a substrate, a second layer deposited on a top surface of the first layer, and the via spanning multiple layers. The via can include a first bottom that is formed on a top surface of the first layer and a first sidewall that upstands from the first bottom and extending at least through the second layer.
    Type: Application
    Filed: May 20, 2016
    Publication date: November 24, 2016
    Inventors: Maurice S. Karpman, Nicole S. Mueller, Gary B. Tepolt, Russell Berman