Patents by Inventor Niels Cornelis Wilhelmus Johannes RIJKERS

Niels Cornelis Wilhelmus Johannes RIJKERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IC die, ultrasound probe, ultrasonic diagnostic system and method
    Patent number: 10586753
    Abstract: An integrated circuit (IC) die (100) is disclosed having a major surface delimited by at least one edge (102) of the IC die, said major surface carrying a plurality of electrically conductive contact plates (130) extending from said major surface beyond the at least one edge such that each contact plate includes an exposed contact surface portion (132) delimited by the at least one edge for mating with an electrically conductive further contact surface portion (230) on at least one further edge (220) of a body (200), said at least one further edge delimiting a cavity for receiving the IC die. An ultrasound probe including such an IC die and a method of providing such an IC die with contacts are also disclosed.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: March 10, 2020
    Assignee: Koninklijke Philips N.V.
    Inventors: Egbertus Reinier Jacobs, Johannes Wilhelmus Weekamp, Niels Cornelis Wilhelmus Johannes Rijkers
  • IC DIE, ULTRASOUND PROBE, ULTRASONIC DIAGNOSTIC SYSTEM AND METHOD
    Publication number: 20170136496
    Abstract: An integrated circuit (IC) die (100) is disclosed having a major surface delimited by at least one edge (102) of the IC die, said major surface carrying a plurality of electrically conductive contact plates (130) extending from said major surface beyond the at least one edge such that each contact plate includes an exposed contact surface portion (132) delimited by the at least one edge for mating with an electrically conductive further contact surface portion (230) on at least one further edge (220) of a body (200), said at least one further edge delimiting a cavity for receiving the IC die. An ultrasound probe including such an IC die and a method of providing such an IC die with contacts are also disclosed.
    Type: Application
    Filed: March 31, 2015
    Publication date: May 18, 2017
    Inventors: Egbertus Reinier JACOBS, Johannes Wilhelmus WEEKAMP, Niels Cornelis Wilhelmus Johannes RIJKERS