Abstract: The invention relates to a method of preparing a sample for analysis. The method comprises: providing a sample comprising a surface region of interest on a first face of the sample and a second face oriented at an angle to the first face about a common edge between the first and second faces, the second face extending between the common edge and a second edge on the opposing side of the second face of the sample; and milling the second face of the sample to provide a trench in the surface of the second face, the trench extending from a first position on the second face between the common edge and the second edge to a second position adjacent to the common edge; wherein the trench is arranged so as to provide an electron transparent sample layer comprising the surface region of interest. By milling the second face of the sample only, a surface region of interest on the first face of the sample is fully preserved and remains free of milling beam induced damage.

Abstract: A method is provided for analysing electron backscatter diffraction data generated from a sample material. An image data set representative of an image of electron backscatter diffraction bands is obtained from the sample material. A set of estimated first diffraction parameters is then generated, these defining individual electron backscatter diffraction bands in the image data set. A candidate phase is then selected together with a respective orientation for the material, based upon the generated set of estimated parameters thereby identifying diffraction bands in the image data set. Second diffraction parameters of the identified diffraction bands are simulated for the candidate phase according to the respective orientation. These second diffraction parameters are then adjusted for the identified simulated bands so as to fit the simulated bands to the bands in the image data.

Abstract: A method is provided for analysing electron backscatter diffraction data generated from a sample material. An image data set representative of an image of electron backscatter diffraction bands is obtained from the sample material. A set of estimated first diffraction parameters is then generated, these defining individual electron backscatter diffraction bands in the image data set. A candidate phase is then selected together with a respective orientation for the material, based upon the generated set of estimated parameters thereby identifying diffraction bands in the image data set. Second diffraction parameters of the identified diffraction bands are simulated for the candidate phase according to the respective orientation. These second diffraction parameters are then adjusted for the identified simulated bands so as to fit the simulated bands to the bands in the image data.