Abstract: A multiband phone capable of transmitting a signal within a plurality of distinct frequency bands having a single wide frequency range power detecting device capable of measuring the power of the transmitted signal over all of the plurality of frequency bands. The multiband phone includes multiple power amplifiers, where each power amplifier amplifies the power of a signal transmitted within a different frequency band. A power amplifier controller is provided for controlling the amount of amplification performed by the power amplifiers, where a switching device switches the connection of the power amplifier controller to a selected power amplifier. The single wide frequency range power detecting device is connected to the output of the all of the power amplifiers through a switching device, where the switching device connects the power detecting device to the particular power amplifier selected for transmission.

Abstract: A system having dualband power amplifier control in a dualband phone is provided using a single power amplifier controller. The dualband phone includes two power amplifiers, where each power amplifier amplifies the power of a signal transmitted at a different frequency band. A power amplifier controller is provided for controlling the amount of amplification performed by both of the power amplifiers, and a power amplifier switching device is connected to the power amplifier controller for switching the connection of the power amplifier controller between the two power amplifiers. The system further includes a processing device which monitors the quality and strength of the received signal transmitted by various base stations in the transmission region of the dualband phone.

Abstract: Disclosed is an amplifier module suitable for automated mounting and connecting to a motherboard of a cellular phone. The amplifier module comprises a substrate which has at least two layers of electrically conducting material. On the substrate, a first and second semiconductor chip are mounted. The first semiconductor chip includes a first integrated circuit which forms part of a first power amplifier adapted for a first radio frequency band. The second semiconductor chip includes a second integrated circuit which forms part of a second power amplifier adapted for a second radio frequency band. The first and second chips are positioned on the substrate and electrically connected to components mounted on the substrate.

Abstract: A probe unit for automatic determination of quality properties in meat comprises an insertion probe with a measuring device, such as a light reflection meter, at a free end of the probe. A double-acting drive cylinder unit reciprocatingly moves the insertion probe and consists of an interior pipe surrounded by an outer impact resistant pipe. A tubular piston rod is reciprocatingly slidably arranged in the interior pipe. The piston rod extends through both ends of the interior pipe and has an overall length at least twice the length of its stroke. The front end of the piston rod serves as the insertion probe while the rear end of the piston rod carries or forms part of a position meter producing electric pulses indicative of the position of the light reflection meter with respect to the interior pipe. The position meter includes a signal generator with a toothed wheel engaging a toothed rack and generates pulses applied to a pulse counter.