Abstract: An improved bimetal actuator is disclosed. A thin film resistor is fixed to the high expansion side of a bimetal element and, when energized, generates sufficient heat to actuate the bimetal. The resistor has a serpentine configuration formed by a continuous series of loops, each successive loop having a greater width from the fixed to the free end of the bimetal, to provide differential heating of the bimetal and thus a greater movement of its free end for the power dissipated in the resistor.

Abstract: An improved illuminated display system is disclosed which can be positively and accurately assembled with a plurality of low profiled illuminated indicator units to display a wide variety of input information. The illuminated indication is provided by a plurality of light emitting diodes inserted in edgewise fashion into slots in flat flexible circuitry with the remaining components attached thereto in conventional fashion. The circuit assembly is folded into containers to form the individual indicator units which are likewise, preferably, inserted into apertures in high current flat flexible circuitry to make wiping contact with the conductors thereof. The subject system obviates the prior art requirement for working in cramped spaces behind panels by providing the means to connect the indicator units of a display to associated circuitry from the front of the panel thereby producing a low profiled display panel.

Abstract: A narrow lead contact is disclosed for face down bonding of electronic chips, such as light emitting diodes. The narrow lead and the circuitry associated with the chip or diode is formed on a thin film of transparent insulating material in a conventional manner. The chip is placed face down on the lead on the film and bonded thereto. The bonding can be accomplished by known methods including solder reflow or conductive epoxys. A second lead, which may include a reflector in the case of a light emitting diode, is attached to another point on the chip. When the chip is a light emitting diode, the chip assembly can be encapsulated in a lens system which is attached to both sides of the film. Most of the light emitted from the back and sides of the diode is thus passed out through the film and lens system since the thin lead will preferably obscure less than 35% of the face of the diode. The circuitry formed on the thin film may contain an adjustable resistance to compensate for variations in light intensity.

Abstract: A narrow lead contact is disclosed for face down bonding of electronic chips, such as light emitting diodes. The narrow lead and the circuitry associated with the chip or diode is formed on a thin film of transparent insulating material in a conventional manner. The chip is placed face down on the lead on the film and bonded thereto. The bonding can be accomplished by known methods including solder reflow or conductive epoxys. A second lead, which may include a reflector in the case of a light emitting diode, is attached to another point on the chip. When the chip is a light emitting diode, the chip assembly can be encapsulated in a lens system which is attached to both sides of the film. Most of the light emitted from the back and sides of the diode is thus passed out through the film and lens system since the thin lead will preferably obscure less than 35% of the face of the diode. The circuitry formed on the thin film may contain an adjustable resistance to compensate for variations in light intensity.