Patents by Inventor Nien-Chun Chin

Nien-Chun Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110101847
    Abstract: A field emission cathode plate is disclosed, which includes: a substrate; a cathode layer, disposed on the substrate; a conductive layer with an arc surface or a resistor layer with an opening and resistivity larger than that of the cathode layer, disposed on the cathode layer; and a cambered field emission layer, having an arc surface and disposed on the conductive layer or on the cathode layer in the opening of the resistor layer and covering the resistor layer around the opening. The present invention also provides a method for fabricating the above-mentioned field emission cathode plate. The method can provide field emission cathode plate achieving uniform field emission and does not involve high resolution and cost.
    Type: Application
    Filed: January 6, 2011
    Publication date: May 5, 2011
    Applicants: Tatung Company, Industrial Technology Research Institute
    Inventors: Hung-Yuan LI, Jian-Min Jeng, Ching-Hsuang Cheng, Nien-Chun Chin, Tzung-Han Yang
  • Publication number: 20100123382
    Abstract: A field emission cathode plate is disclosed, which includes: a substrate; a cathode layer, disposed on the substrate; a conductive layer with an arc surface or a resistor layer with an opening and resistivity larger than that of the cathode layer, disposed on the cathode layer; and a cambered field emission layer, having an arc surface and disposed on the conductive layer or on the cathode layer in the opening of the resistor layer and covering the resistor layer around the opening. The present invention also provides a method for fabricating the above-mentioned field emission cathode plate. The method can provide field emission cathode plate achieving uniform field emission and does not involve high resolution and cost.
    Type: Application
    Filed: April 23, 2009
    Publication date: May 20, 2010
    Applicants: Tatung Company, Industrial Technology Research Institute
    Inventors: Hung-Yuan Li, Jian-Min Jeng, Ching-Hsuang Cheng, Nien-Chun Chin, Tzung-Han Yang