Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.

Abstract: A method for improving the integrated circuits bonding firmness, whose principle is that after the later film is piled on top of the previous film, the upper surface of the later film will be affected by the previous film. Among the metal layers of the multi-level interconnection, the metal layer under and most close to the bond pad metal (the top metal layer of the multi-level interconnection) has a regular or an irregular layout pattern, which is under the predetermined regions serving as bond pad windows. These regular or irregular layout patterns result in a rough upper surface, and then improves the firmness of bond wires.

Abstract: A method for improving the integrated circuits bonding firmness, whose principle is that after the later film is piled on top of the previous film, the upper surface of the later film will be affected by the previous film. Among the metal layers of the multi-level interconnection, the metal layer under and most close to the bond pad metal (the top metal layer of the multi-level interconnection) has a regular or an irregular layout pattern, which is under the predetermined regions serving as bond pad windows. These regular or irregular layout patterns result in a rough upper surface, and then improves the firmness of bond wires.

Abstract: A method for improving the integrated circuits bonding firmness, whose principle is that after the later film is piled on top of the previous film, the upper surface of the later film will be affected by the previous film. Among the metal layers of the multi-level interconnection, the metal layer under and most close to the bond pad metal (the top metal layer of the multi-level interconnection) has a regular or an irregular layout pattern, which is under the predetermined regions serving as bond pad windows. These regular or irregular layout patterns result in a rough upper surface, and then improves the firmness of bond wires.

Abstract: A Venetian blind having a head rail with a plurality of ladder cords and vertical cords vertically mounted and spaced apart therebelow, a plurality of slats being positioned between the ladder cords and the vertical cords formed a shade, the bottom of the head rail being a lower rail, characterized in that the external edge of the head rail is mounted with an upper rail formed from plastic injection molding for enabling cutting the length thereof, the cross-section of the upper rail is substantially “U” shaped and the edges of the upper rail are individually provided with two hook-like edges, and a plurality of holes are provided on the upper rail for the insertion of the ladder cords, the vertical cords, and a lift cord, to thereby provide support for a venetian blind within various sized structural openings.

Abstract: This invention relates to an attachable hand-operated/automatic dual usage venetian blind controller which can be attached to an existing venetian blind to set the blades of such a venetian blind together at any angle or to draw up the blades together to one side of the window by means of infrared remote control so as to regulate the light and air passing through. During power failure, the venetian blind can be controlled through hand operation without removing the controller. The controller of this invention is generally comprised of two DC motor and speed reducing gear set assemblies, two guide wheels, two pressure wheels, a beading cord driving wheel, a pull cord driving wheel, an infrared receiver control circuit, and an infrared transmitter.

Abstract: The invention relates to the control of vertical louver, which is to improve the slide-tract of regular vertical louvers, by means of motor and drag chain to control the opening and closing, and the expansion and collapsing of the blades; by means of pressing down the control button of the control panel to automatically control the louver; respective limit switches being provided for limit control on opening, closing, expanding and collapsing, so as to make the invention become more practical.