Abstract: A method of forming a conductive pattern on a substrate. The method comprising providing a substrate carrying a conductive layer; forming a first portion of the conductive pattern by exposing the conductive layer to a laser and controlling the laser to remove conductive material around the edge(s) of desired conductive region(s) of the first portion; and laying down an etch resistant material on the conductive layer, the etch resistant material defining a second portion of the conductive pattern, removing conductive material from those areas of the second portion not covered by the etch resistant material, and then removing the etch resistant material.

Abstract: A method of forming a two-dimensional mask pattern on a substrate (1). The method comprises: (a) printing a non-electrically conductive material (2) on a substrate in a coarse version of a desired mask pattern (3A-3D); and (b) selectively ablating a portion (3B) of the material using a laser to refine the coarse pattern to form the desired mask pattern.

Abstract: A method of printing an image (12) on a substrate (11) comprises controlling an inkjet printer head (10) having a plurality of nozzles (21-23) to print the image on a substrate in a series of swaths (30A, 30B). Periodically, a check for full or partial blockages in a nozzle of the inkjet printer head is performed by causing each nozzle (21-23) to print the same predetermined pattern (1, 1?, 1?) on a substrate and analysing the patterns to determine any differences between them and to identify a blocked or partially blocked nozzle if its printed pattern differs by more than a predetermined amount from that of the other nozzle(s). The checking step is carried out following each swath (30A, 30B) of the inkjet printer head (10) across the substrate (11).