Patents by Inventor Nigel Frederick Clay

Nigel Frederick Clay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
    Patent number: 6840434
    Abstract: One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 degrees C. lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: January 11, 2005
    Assignees: Ford Motor Company, Johnson Manufacturing Company
    Inventors: Nigel Frederick Clay, Tsung-Yu Pan, Alan Edward Gickler, Frederic Hilaire LePrevost, Jr.
  • Tin- and zinc-based solder fillers for aluminum body parts and methods of applying the same
    Publication number: 20030189086
    Abstract: One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 E C lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.
    Type: Application
    Filed: April 9, 2002
    Publication date: October 9, 2003
    Applicant: Ford Motor Company
    Inventors: Nigel Frederick Clay, Tsung-Yu Pan, Alan Edward Gickler, Frederic Hilaire LePrevost