Abstract: An electronic device with a sealing layer is disclosed. The sealing layer may include several enhancements designed to improve the overall sealing performance. For instance, the sealing layer may include an adhesive material and several particles embedded in the adhesive material. The embedded particles may include liquid-activated particles that respond to liquid exposure. In some instances, the liquid-activated particles absorb the liquid. Additionally, the liquid-activated particles may expand and fill/cover areas previously occupied by the sealing layer or another structure of the electronic device. Further, the liquid-activated particles may adhere to one or more structures of the electronic device, thereby providing the sealing layer with sealing properties.