Abstract: A titanium alloy having 1.50 to 7.00 wt. % aluminium, 3.00 to 5.00 wt. % vanadium, 1.00 to 3.00 wt. % molybdenum; 0.50 to 2.50 wt. % zirconium, 0.05 to 0.40 wt. % oxygen, 0.05 to 2.00 wt. % tin, 0.00 to 1.00 wt. % iron, 0.00 to 0.3 wt % silicon, 0.01 to 0.15 wt. % carbon, and 0.001 to 0.05 wt. % nitrogen; the balance being titanium and incidental elements and unavoidable impurities.

Abstract: A semiconductor package includes a combination die embedded in a base. The combination die includes a plurality of functional blocks, where the functional blocks are insulated from one another on the combination die. Each functional block has plural die connectors. The base includes insulating layers conductive layers and vias. Each conductive layer has parts removed to form a pattern. The base is provided with a plurality of external connectors. A conductive path, made from a part of at least one of the conductive layers and at least one of the vias, connects one of the die connectors to a respective one of the external connectors.

Abstract: A transceiver front-end having a plurality of signal paths operatively connected to at least two electrically separated antennas for transmitting and receiving communication signals in a plurality of frequency bands in GSM and W-CDMA modes. If the frequency band of one signal path is partially overlapping with the frequency band of another signal path, these two signal paths are connected to two different antennas. As such, some of the switching components and matching elements in the transceiver front-end can be eliminated. As a result, the reception loss can be reduced.

Abstract: A semiconductor package includes a combination die embedded in a base. The combination die includes a plurality of functional blocks, where the functional blocks are insulated from one another on the combination die. Each functional block has plural die connectors. The base includes insulating layers conductive layers and vias. Each conductive layer has parts removed to form a pattern. The base is provided with a plurality of external connectors. A conductive path, made from a part of at least one of the conductive layers and at least one of the vias, connects one of the die connectors to a respective one of the external connectors.

Abstract: A receive front-end module having one or more 2 GHz Rx paths and one or more W-CDMA Rx paths for use in a portable communication device, such as a mobile phone or a communicator device. The module comprises at least two feed points operatively connected to two electrically separate antennas for receiving communication signals. The module also comprises filters for filtering the communication signals in corresponding frequency band, and means for providing cross-band isolation. The cross-band isolation is achieved by using linear amplifiers in different signal paths, for example. Advantageously, the module comprising three signal paths so that one or more modules can be used together to achieve MIMO/diversity functionality.

Abstract: An electronic assembly including a substrate; a semiconductor die; and a shield formed around and mounted to the semiconductor die and located, at least partially, between the semiconductor die and the substrate. A method of assembling an electronic assembly includes selecting a first electronic component assembly from a plurality of different electronic component assemblies, the first electronic component assembly including a semiconductor die with an attached shield; and connecting the selected first electronic component assembly to a substrate to form the electronic assembly. The electronic assembly is formed with the shield already attached to the semiconductor die without having to attached the shield to the semiconductor die or substrate after the semiconductor die is attached to the substrate.

Abstract: A receive front-end module in a multi-band communication device. The communication device comprises a plurality of signal paths for receiving and transmitting communication signals in a plurality of frequency bands in GSM and W-CDMA modes. The signal paths in the receive front-end module are operatively connected to a common feed point, which is connected to one of the RF antennas of the communication device, and the signal paths are selected such that none of the frequency bands for receiving communication signals in the receive front-end module are overlapping. If the communication device also transmits the communication signal in at least one transmit frequency range partially overlapping with one of the frequency bands in the receive front-end module, switching means is provided to at least one of signal paths in the receive front-end module for providing cross-band isolation between the transmitted and received communication signals.

Abstract: A receive front-end module in a multi-band communication device. The communication device comprises a plurality of signal paths for receiving and transmitting communication signals in a plurality of frequency bands in GSM and W-CDMA modes. The signal paths in the receive front-end module are operatively connected to a common feed point, which is connected to one of the RF antennas of the communication device, and the signal paths are selected such that none of the frequency bands for receiving communication signals in the receive front-end module are overlapping. If the communication device also transmits the communication signal in at least one transmit frequency range partially overlapping with one of the frequency bands in the receive front-end module, switching means is provided to at least one of signal paths in the receive front-end module for providing cross-band isolation between the transmitted and received communication signals.

Abstract: A receive front-end module having one or more 2 GHz Rx paths and one or more W-CDMA Rx paths for use in a portable communication device, such as a mobile phone or a communicator device. The module comprises at least two feed points operatively connected to two electrically separate antennas for receiving communication signals. The module also comprises filters for filtering the communication signals in corresponding frequency band, and means for providing cross-band isolation. The cross-band isolation is achieved by using linear amplifiers in different signal paths, for example. Advantageously, the module comprising three signal paths so that one or more modules can be used together to achieve MIMO/diversity functionality.

Abstract: A transceiver front-end having a plurality of signal paths operatively connected to at least two electrically separated antennas for transmitting and receiving communication signals in a plurality of frequency bands in GSM and W-CDMA modes. If the frequency band of one signal path is partially overlapping with the frequency band of another signal path, these two signal paths are connected to two different antennas. As such, some of the switching components and matching elements in the transceiver front-end can be eliminated. As a result, the reception loss can be reduced.