Abstract: A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.

Abstract: A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.

Abstract: A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.

Abstract: A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.

Abstract: Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of tie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.

Abstract: An electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. A package includes a shield case formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole; a resin case molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal that is insert-molded in the resin case such that the hot terminal is inserted into the shield case through the through hole without contact. One end of the hot terminal is exposed at an inner surface of the resin case, and the other end of the hot terminal is exposed at an outer surface of the resin case. An element contained in the package is surrounded by the shield case so that good shielding performance is obtained.

Abstract: An electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. A package includes a shield case formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole; a resin case molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal that is insert-molded in the resin case such that the hot terminal is inserted into the shield case through the through hole without contact. One end of the hot terminal is exposed at an inner surface of the resin case, and the other end of the hot terminal is exposed at an outer surface of the resin case. An element contained in the package is surrounded by the shield case so that good shielding performance is obtained.

Abstract: Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of fie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.

Abstract: To provide a resin molding machine that can reduce cost by eliminating the need for a residual-material remover, and can reduce cycle time and the amount of residual material, the resin molding machine includes a stationary cavity plate that has a gate communicating with a cavity, a sprue bushing in which a sprue is formed for feeding a molding material through the gate into the cavity, a runner plate disposed between the stationary cavity plate 13 and the sprue bushing, a cylinder unit (runner-plate driving mechanism) for rectilinearly reciprocating the runner plate between ejecting positions and via a molding position, the ejecting positions being separated from the molding position A and provided for ejecting the residual material, and an ejecting channel (residual-material ejecting mechanism) for ejecting the residual material at the ejecting positions.

Abstract: To provide a resin molding machine that can reduce cost by eliminating the need for a residual-material remover, and can reduce cycle time and the amount of residual material, the resin molding machine includes a stationary cavity plate 13 that has a gate 13a communicating with a cavity C, a sprue bushing 16 in which a sprue 16a is formed for feeding a molding material through the gate 13a into the cavity C, a runner plate 20 disposed between the stationary cavity plate 13 and the sprue bushing 16, a cylinder unit (runner-plate driving mechanism) 25 for rectilinearly reciprocating the runner plate 20 between ejecting positions B1 and B2 via a molding position A, the ejecting positions B1 and B2 being separated from the molding position A and provided for ejecting the residual material, and an ejecting channel (residual-material ejecting mechanism) 30 for ejecting the residual material at the ejecting positions B1 and B2.

Abstract: A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts being transported on the upper plane of the transporting member; and a shutter for opening and closing at the tip of the guiding groove, so as to cover the space above the first part in the row so as to prevent the part from flying out.

Abstract: A feeder for chip components is provided wherein the chip components can be supplied with high stability even in high-speed operation by operating a conveying member at a lower speed than that of a chip mounter and operating the conveying member even when the chip mounter is stopped. The chip components on a belt are supplied in one direction by lowering a feed lever according to the input load from a chip mounter so as to drive the belt connected to the feed lever via a transmission mechanism intermittently in one direction. urging means is provided for urging the feed lever in the returning direction by storing the input load of the chip mounter as energy while an eddy current damper is provided for delaying the returning operation of the feed lever relative to the returning operation of the chip mounter. When the chip mounter operates downwardly, the feed lever is moved downwardly by linking to the chip mounter while the conveyor belt is maintained in a stationary state.

Abstract: There is disclosed a part-aligning apparatus that is simple in structure, less damages chip parts, and operates well even if its chip discharge passage is clogged or overflows. The apparatus has a part-holding chamber for accommodating a number of chip parts. An arc-shaped chute groove is formed in the inner surface of the bottom of the part-holding chamber to orient the chip parts in a given direction and to guide the sliding chips. A gate port is formed at the lower end of the chute groove to pass the sliding chip parts one by one. The discharge passage is formed tangent to the chute groove to align the passed chip parts in a row and to deliver them. Claw portions for removing clogging are formed on the inner surface of a rotary drum that forms the part-holding chamber. The claw portions urge any chip part halted in the gate port in an abnormal posture toward an opposite direction different from the direction in which the chips are delivered.

Abstract: A feed lever is lowered, correspondingly to the load input of a chip mounter. A rotary drum is intermittently moved through a conversion mechanism, intermittently in one direction. Chip components placed in a component accommodation chamber are aligned and discharged. When a rotation resistance larger than a predetermined value acts, a belt is slid, and breaking of a chip component is prevented.

Abstract: A component carrying device has a simple constitution, and is capable of lining up components and carrying them in one direction with high reliability. The device comprises a guide groove for lining up components into one line and guiding them; a carrying member, provided on the bottom face of the guide groove, which can move forward and backward along the direction of the groove; and driving means, for driving the carrying member forward and backward at a higher speed when moving backward than when moving forward. The speed of the carrying member when moving forward is a speed at which a predetermined sustained frictional force acts between the carrying member and the components, which are mounted on the top face of the carrying member; and the speed of the carrying member when moving backward is a speed at which the frictional force between the carrying member and the components mounted on its top face, substantially breaks, so that the components are carried forward by the difference in frictional force.

Abstract: A subject part-aligning apparatus has a simple structure and causes less damage to chip parts, and operates well even if a chip discharge passage thereof is clogged or overflows with the chip parts. The apparatus has a part-holding chamber for accommodating a number of chip parts. An arc-shaped chute groove is formed in the inner surface of the bottom of the part-holding chamber to orient the chip parts in a given direction and to slidably guide the chips. A gate port is formed at the lower end of the chute groove to permit the chip parts sliding downward in a given orientation along the chute groove to pass in series (e.g., one by one). The discharge passage is formed to be tangential to the chute groove to align the passed chip parts in a line and to discharge the chip parts. A rotary impeller having blades is mounted in the part-holding chamber. The blades urge any chip part halted in an abnormal orientation in the gate port toward a direction opposite to the direction in which the chips are discharged.

Abstract: A component carrying device has a simple constitution, and is capable of lining up components and carrying them in one direction with high reliability. The device comprises a guide groove for lining up components into one line and guiding them; a carrying member, provided on the bottom face of the guide groove, which can move forward and backward along the direction of the groove; and driving means, for driving the carrying member forward and backward at a higher speed when moving backward than when moving forward. The speed of the carrying member when moving forward is a speed at which a predetermined sustained frictional force acts between the carrying member and the components, which are mounted on the top face of the carrying member; and the speed of the carrying member when moving backward is a speed at which the frictional force between the carrying member and the components mounted on its top face, substantially breaks, so that the components are carried forward by the difference in frictional force.

Abstract: A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards.

Abstract: A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts being transported on the upper plane of the transporting member; and a shutter for opening and closing at the tip of the guiding groove, so as to cover the space above the first part in the row so as to prevent the part from flying out.

Abstract: A part transporting apparatus comprises a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts being transported on the upper plane of the transporting member; and a shutter for opening and closing at the tip of the guiding groove, so as to cover the space above the first part in the row so as to prevent the part from flying out.