Abstract: A piezoelectric vibration element includes a piezoelectric piece, a pair of excitation electrodes, and a pair of extraction electrodes. The piezoelectric piece has a rectangular shape with long sides and short sides and a first principal surface and a second principal surface. The piezoelectric piece includes a mesa portion thicker than a peripheral portion at least on the first principal surface. The excitation electrode is larger than an area of the mesa portion and covers the mesa portion on the principal surface where the mesa portion is formed. The excitation electrode has a center away from a center of the piezoelectric piece toward another short side by a first distance. The mesa portion has a center away from the center of the piezoelectric piece to the other short side by a second distance. The second distance is different from the first distance.

Abstract: A surface mount type piezoelectric device includes a piezoelectric vibrating piece, a base plate in a rectangular shape, and a lid plate. The piezoelectric vibrating piece includes a vibrator vibrating at a predetermined vibration frequency. The base plate has one principal surface where the piezoelectric vibrating piece being to be placed. The lid plate seals the vibrator. The other principal surface of the base plate includes a pair of mounting terminals to mount the piezoelectric device. The pair of mounting terminals includes a metal film and an electroless plating film. The electroless plating film is formed on a surface of the metal film. The mounting terminal includes a trace from which a part of the electroless plating film is removed by laser or dicing.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, a base plate, which has a connecting electrode on one principal surface and a mounting terminal on another principal surface, in a rectangular shape, and a lid plate. The another principal surface of the base plate includes a pair of sides that face one another. At least the pair of sides has a level difference portion depressed toward the one principal surface side and a castellation passing through from the another principal surface to the one principal surface. A wiring electrode extracted from the mounting terminal to the one principal surface of the base plate is at a part of the level difference portion and the castellation. The wiring electrode and the mounting terminal include a metal film formed by sputtering or vacuum evaporation and an electroless plating film formed on the metal film by electroless plating.

Abstract: A method for fabricating a piezoelectric device includes preparing a piezoelectric wafer, preparing a first wafer, bonding the piezoelectric wafer and the first wafer, preparing a first terminal mask for forming a pair of hot terminals on the bottom surface and a second terminal mask for forming the pair of hot terminals and a grounding terminal as a ground point, selecting an arrangement of the first terminal mask and an arrangement of the second terminal mask on a bottom surface of the first wafer after the wafer bonding, and forming a bottom surface with the power supply terminal and the output terminal through the first terminal mask, or a bottom surface with the power supply terminal, the output terminal, and the grounding terminal through the second terminal mask, after selecting the arrangement.

Abstract: An ultrasonic transducer includes an ultrasonic transmitting and receiving portion, a housing, a driving device, a casing, a first volume compensation mechanism, a ventilating portion, a diaphragm, and a component. The housing houses the ultrasonic transmitting and receiving portion, and the housing seals ultrasonic propagation liquid. The driving device is configured to drive the ultrasonic transmitting and receiving portion. The casing houses the driving device. The first volume compensation mechanism is configured to absorb a volume change of the ultrasonic propagation liquid. The diaphragm divides an internal space of the casing into at least a first internal space and a second internal space. The ventilating portion is configured to ventilate the first internal space to outside of the casing. The component is disposed in a space other than the first internal space in the internal space and includes a frame ground that electrically connects to an electrical circuit.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece and a base portion in a square shape. The piezoelectric vibrating piece includes a piezoelectric piece, a pair of excitation electrodes, and a pair of extraction electrodes. The base portion includes a pair of connecting electrodes on a first surface at a side of the piezoelectric vibrating piece and a pair of mounting terminals on a second surface. The base portion has short sides facing one another. The short sides include two pairs of castellations depressed toward a center side of the base portion and two pairs of side surface electrodes on the two pairs of castellations. The two pairs of side surface electrodes connect the first surface and the second surface. One pair of the two pairs of side surface electrodes each connect to the pair of connecting electrodes and the pair of mounting terminals.

Abstract: An AT-cut quartz crystal vibrating piece with an excitation unit is in a rectangular shape. The quartz crystal vibrating piece includes a framing body, a connecting portion, a pair of excitation electrodes, and a pair of extraction electrodes. The excitation unit has a long side that is rotated at 61° or 119° with respect to the crystallographic axis X. The framing body has a long side that extends in 61° or 119° direction with respect to the crystallographic axis X. The connecting portion extends in 61° or 119° direction with respect to the crystallographic axis X. The connecting portion is perpendicular to a short side of the excitation unit and a short side of the framing body.

Abstract: An oscillator includes a first crystal resonator, a second crystal resonator, a first amplifier circuit for oscillation, a second amplifier circuit for oscillation, a mixer circuit, a frequency selection circuit, and a first frequency conversion circuit. Assuming that resonance frequencies of the first and the second crystal resonators at a reference temperature are respectively F1 and F2, and temperature coefficients expressed as a rate of change corresponding to temperatures of the resonance frequencies of the first and the second crystal resonators are respectively A1 and A2, the relationship of F2/F1?|A1/A2| is satisfied. A signal with a temperature compensated frequency is obtained from the frequency selection circuit.

Abstract: A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.

Abstract: A contour mode disk resonator includes a substrate, a disk-shaped vibration plate, a pair of input electrodes, a pair of output electrodes, a supporting joist with one end, and an absorbing portion. The pair of input electrodes is disposed to face one another via the vibration plate in a planar view. The pair of output electrodes is disposed to face one another via the vibration plate in a direction intersecting with a direction where the pair of input electrodes faces one another in the planar view. The one end is integrally secured to a portion corresponding to a vibration node that occurs by a contour vibration in an outer periphery of the vibration plate. The supporting joist includes an absorbing portion configured to absorb strain energy generated by the contour vibration in the supporting joist.

Abstract: A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator.

Abstract: To easily detect an external force applied to a piezoelectric element with high accuracy and suppress influence of electrostatic charges accumulated in the piezoelectric element. A crystal element is cantilevered inside the container. Excitation electrodes are formed on upper and lower faces, respectively, of the crystal element. A movable electrode connected to the excitation electrode is provided in a leading end portion of the lower face side of the crystal element, and a stationary electrode is provided in a bottom portion of the container. An oscillation loop including the excitation electrodes, the movable electrode, the stationary electrode, and the oscillator circuit is formed. A capacitance change between the electrodes caused by a deflection of the crystal element due to an external force is detected as a frequency. A switch for opening or closing the neutralization path to discharge electrostatic charges generated in the crystal element to the ground is provided.

Abstract: A resonator includes an interdigital transducer electrode, a resonance part, a supporting part, and two beam parts. The interdigital transducer electrode is disposed on a piezoelectric thin film. The resonance part is held on a substrate through an air gap. The supporting part supports the resonance part. The two beam parts connect the resonance part to the supporting part at both ends of the resonance part. The air gap forms a level difference at the supporting part or level differences at the respective two beam parts.

Abstract: A surface mount piezoelectric oscillator includes a piezoelectric resonator, a mounting board, and an IC chip mounted on the mounting board. An oscillator circuit includes the IC chip and the piezoelectric resonator. The piezoelectric resonator is bonded to the mounting board with solder balls. The mounting board includes a ceramic plate. The mounting board includes connecting terminals and a wiring pattern on the one mounting board principal surface of the mounting board. The connecting terminals are connected to the terminals of the piezoelectric resonator via solder balls. The mounting board includes an intermediate layer on the one mounting board principal surface and integrally formed with the mounting board. The intermediate layer includes solder ball placement openings to position the solder balls in a center of each of the connecting terminals and an IC chip mounting opening to mount the IC chip.

Abstract: A tuning-fork type piezoelectric vibrating piece (20) is comprised of a base portion (23) comprising a piezoelectric material, a pair of vibrating arms (21) extends parallel from the base portion with a first thickness, a excitation electrode film (33, 34) formed on the vibrating arms, a pair of tuning portions (28) formed at the distal ends of the vibrating arms (21) with a second thickness which is less than the first thickness; and a metal film (18) formed on at least one surface o the tuning portion.

Abstract: An oscillator includes a nominal frequency output unit, a frequency adjustment amount output unit, a gain output unit, a multiplier, and an adder. The nominal frequency output unit is configured to output a first digital value corresponding to the nominal frequency. The frequency adjustment amount output unit is configured to output a second digital value corresponding to a rate of frequency in order to set a frequency adjustment amount with respect to the nominal frequency using the rate of frequency. The gain output unit is configured to output a third digital value corresponding to a gain to be multiplied by the second digital value. The multiplier is configured to multiply the second digital value by the third digital value, thus outputting a fourth digital value. The adder adds the first digital value and the fourth digital value to output the added result as a setting signal of frequency.

Abstract: A value corresponding to a difference value between a value corresponding to a difference between f1 and f1r and a value corresponding to a difference between f2 and f1r is treated as an instantaneous temperature, where f1 and f2 denote oscillation outputs of the first and second oscillation circuits, respectively, and f1r and f1r denote oscillation frequencies of the first and second oscillation circuits, respectively, at a reference temperature. A first correction value is obtained using an approximation formula of the frequency correction value of f1 based on the value corresponding to the difference value, and a second correction value for canceling a correction residual error is obtained from the correction residual error which is a difference between the first correction value and the frequency correction value actually measured. The frequency correction value is obtained from a sum of the first and second correction values.

Abstract: A piezoelectric vibrating piece includes an excitation unit in a rectangular shape, a framing portion, and a connecting portion. The excitation unit includes two principal surfaces, a pair of excitation electrodes on the principal surfaces, a first side extending in a first direction, and a second side extending in a second direction. The second side is longer than the first side, and is perpendicular to the first direction. The framing portion surrounds the excitation unit. The connecting portion connects the excitation unit to the framing portion. The connecting portion has a third side which is connected to the first side and extends in the first direction and a fourth side which is connected to the framing portion and extends in the first direction. A thickness of the connecting portion is thinner than that of the framing portion. The third side has a different length from that of the fourth side.

Abstract: A piezoelectric vibrating piece includes an excitation unit in a rectangular shape, a framing portion, a connecting portion, and a protrusion. The excitation unit includes a pair of excitation electrodes on the pair of principal surfaces, a first side that extends in a first direction, and a second side that extends in a second direction. The second side is longer than the first side. The second direction is perpendicular to the first direction. The connecting portion connects the first side of the excitation unit to the framing portion. The connecting portion is thinner than the framing portion. The protrusion protrudes in the thickness direction in at least one of the connecting portion and a region between the connecting portion and the excitation electrode. The length of the protrusion in the first direction is equal to or longer than a length of the connecting portion in the first direction.

Abstract: Disclosed is a surface acoustic wave device which has IDT electrodes arranged over a lithium tantalate piezoelectric substrate and is capable of suppressing propagation losses even at a high frequency band equal to or higher than 2 GHz as low as possible in order to utilize surface acoustic waves including LSAW. For this purpose, 45° to 46° rotated YX-cut lithium tantalate substrate is used as the piezoelectric substrate, a thickness of the IDT electrode is set to 7.5% ? to 8% ?, and a metallization ratio in electrode fingers of the IDT electrode is set to 0.55 to 0.65.