Patents by Inventor Niis Holstein

Niis Holstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050140070
    Abstract: In a method of manufacturing metallic or ceramic microparts using a three-dimensional body formed by first and second polymer fractions in a two-component injection molding process, wherein one of the polymer fractions comprises an electrically non-conductive polymer and the second an electrically conductive polymer, the polymer fraction used for the first injection molding step has a higher melting point than the polymer fraction used in the second injection molding step and the metal micropart is formed by galvanic deposition of a metal from an electrolyte and the ceramic micropart is formed by electrophoretic deposition of ceramic material from a ceramic suspension or colloid on the electrically conductive polymer fraction surface of a substrate surface of the interim body.
    Type: Application
    Filed: February 8, 2005
    Publication date: June 30, 2005
    Inventors: Guido Finnah, Jurgen Hausselt, Niis Holstein, Thomas Johann, Volker Piotter, Robert Ruprecht, Gerhard Schanz