Patents by Inventor Nik Mohamed Azeim Nik Zurin

Nik Mohamed Azeim Nik Zurin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rod-based substrate with ringed interconnect layers
    Patent number: 11239126
    Abstract: An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: February 1, 2022
    Assignee: INTEL CORPORATION
    Inventors: Florence Su Sin Phun, Wei Jern Tan, Boon Ping Koh, Nik Mohamed Azeim Nik Zurin, Kai Chong Ng
  • ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS
    Publication number: 20210074598
    Abstract: An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.
    Type: Application
    Filed: March 31, 2017
    Publication date: March 11, 2021
    Inventors: Florence Su Sin Phun, Wei Jern Tan, Boon Ping Koh, Nik Mohamed Azeim Nik Zurin, Kai Chong Ng