Patents by Inventor Nikhil K. Kelkar

Nikhil K. Kelkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit device package having a support coating for improved reliability during temperature cycling
    Patent number: 7423337
    Abstract: An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after solder bumps have been added but prior to dicing. This support coating or underfill layer provides added strength to the eventual reflowed solder connections, such that the operational lifetime of these connections is increased with respect to failure due to temperature cycling.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: September 9, 2008
    Assignee: National Semiconductor Corporation
    Inventors: Viraj A. Patwardhan, Hau Nguyen, Nikhil K. Kelkar, Shahram Mostafazadeh