Patents by Inventor Nikhil RAMAN

Nikhil RAMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE COMPRISING SUBSTRATE WITH COUPLING ELEMENT FOR INTEGRATED DEVICES
    Publication number: 20230223362
    Abstract: A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes a dielectric layer and a plurality of interconnects. The plurality of interconnects includes a first plurality of interconnects configured as a first inductor and a second plurality of interconnects configured as a second inductor. The first integrated device is configured to be coupled to the first inductor. The second integrated device is configured to be coupled to the second inductor. The second integrated device is configured to tune the first inductor through the second inductor.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 13, 2023
    Inventors: FNU SURAJ PRAKASH, Paragkumar Ajaybhai THADESAR, John Jong-Hoon LEE, Nikhil RAMAN, Peng SONG, Francesco CARRARA