Patents by Inventor Nikhilesh Chawla
Nikhilesh Chawla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240093479Abstract: A unit cell of an interwoven lattice structure having an interwoven point therein. The unit cell includes first, second, third, and fourth struts each having an interwoven node offset from the interwoven point. The first strut has a first interwoven node offset from a first diagonal unit cell plane in a first distance and first direction. The second strut has a second interwoven node offset from the first diagonal unit cell plane in a second distance and second direction opposite the first direction. The third strut has a third interwoven node offset from a second diagonal unit cell plane in a third distance and third direction. The fourth strut has a fourth interwoven node offset from the second diagonal unit cell plane in a fourth distance and fourth direction opposite the third direction. The first and second diagonal unit cell planes both pass through the interwoven point.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Inventors: Yash Mistry, Siying Liu, Mandar Shinde, Xiangfan Chen, Dhruv Bhate, Nikhilesh Chawla, Swapnil Morankar, Clint Penick
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Publication number: 20220402024Abstract: A method of making a metal-polymer composite includes dealloying metallic powder to yield porous metal particles, monitoring a temperature of the mixture, controlling the rate of combining, a maximum temperature of the mixture, or both, and combining the porous metal particles with a polymer to yield a composite. Dealloying includes combining the metallic powder with an etchant to yield a mixture. A metal-polymer composite includes porous metal particles having an average particle size of about 0.2 ?m to about 500 ?m and a thermoplastic or thermoset polymer. The polymer composite comprises at least 10 vol % of the porous metal particles. A powder mixture includes porous metal particles having an average particle size of about 0.2 ?m to about 500 ?m and a metal powder. The powder mixture includes about 1 wt % to about 99 wt % of the porous metal particles.Type: ApplicationFiled: June 15, 2022Publication date: December 22, 2022Inventors: Stanislau Niauzorau, Aliaksandr Sharstniou, Amm G. Hasib, Bruno Azeredo, Natalya Kublik, Kenan Song, Nikhilesh Chawla, Sridhar Niverty
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Patent number: 9952272Abstract: Systems and fixtures for mounting, under mechanical constraint, wire-like or fiber-like samples of a high aspect ratio and down to 100 micrometers in diameter are disclosed. A region of interest along the length of the sample resides between and beyond a mechanical constraint on either side, allowing access to the region of interest for a wide number of characterization probes. The fixture may provide electrical isolation between two retaining blocks by means of a dielectric support member. The design may achieve minimal thermal expansion along the length of the sample by the material selection for the dielectric support member. Electrical contact may be introduced to the sample through conductive constraints in the retaining blocks. The fixture may have a minimal size perpendicular to the length axis of the sample to facilitate high probe fluxes when a diverging probe is used. The fixture may provide high x-ray transparency between the retaining blocks.Type: GrantFiled: December 3, 2015Date of Patent: April 24, 2018Assignee: Arizona Board of Regents on behalf of Arizona State UniversityInventors: Nikhilesh Chawla, James E Mertens
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Patent number: 9791385Abstract: A modular X-ray computed tomography (XCT) system having a higher degree of modularity provides experimental versatility and in situ capabilities. The modular XCT system includes interchangeable X-ray sources and detectors that allow for the XCT system to be readily adapted to different imaging tasks, such as those that may require different trade-offs between spatial resolution, exposure time, power, and other scanning parameters.Type: GrantFiled: December 1, 2014Date of Patent: October 17, 2017Assignee: Arizona Board of Regents on Behalf of Arizona State UniversityInventors: James C. E. Mertens, Jason J. Williams, Nikhilesh Chawla
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Publication number: 20160169782Abstract: Systems and fixtures for mounting, under mechanical constraint, wire-like or fiber-like samples of a high aspect ratio and down to 100 micrometers in diameter are disclosed. A region of interest along the length of the sample resides between and beyond a mechanical constraint on either side, allowing access to the region of interest for a wide number of characterization probes. The fixture may provide electrical isolation between two retaining blocks by means of a dielectric support member. The design may achieve minimal thermal expansion along the length of the sample by the material selection for the dielectric support member. Electrical contact may be introduced to the sample through conductive constraints in the retaining blocks. The fixture may have a minimal size perpendicular to the length axis of the sample to facilitate high probe fluxes when a diverging probe is used. The fixture may provide high x-ray transparency between the retaining blocks.Type: ApplicationFiled: December 3, 2015Publication date: June 16, 2016Inventors: Nikhilesh Chawla, James E. Mertens
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Publication number: 20150160354Abstract: A modular X-ray computed tomography (XCT) system having a higher degree of modularity provides experimental versatility and in situ capabilities. The modular XCT system includes interchangeable X-ray sources and detectors that allow for the XCT system to be readily adapted to different imaging tasks, such as those that may require different trade-offs between spatial resolution, exposure time, power, and other scanning parameters.Type: ApplicationFiled: December 1, 2014Publication date: June 11, 2015Applicant: ARIZONA TECHNOLOGY ENTERPRISES, LLCInventors: James C. E. Mertens, Jason J. Williams, Nikhilesh Chawla
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Patent number: 8530058Abstract: A lead free solder consisting of a ternary eutectic composition of Sn-3.9Ag-0.7Cu with Ce in the amount of 0.5 to 2% by weight exhibits improved oxidation resistance increased ductility in comparison with other RE metals and is characterized by a homogeneous mixture of large grain CeSn3 intermetallics in a Sn beta phase. In solder applications, the joints with the solder are resistance to interfacial fracture by distributing the strain within the solder interface increasing impact resistance.Type: GrantFiled: March 6, 2009Date of Patent: September 10, 2013Assignee: Arizona Board of Regents, for and on behalf of Arizona State UniversityInventors: Nikhilesh Chawla, Martha Dudek
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Publication number: 20040226403Abstract: Metallurgical powder compositions are provided that include silicon carbide to enhance the strength, ductility, and machine-ability of the compacted and sintered parts made therefrom. The compositions generally contain a metal powder, such as an iron-based powder, that constitutes the major portion of the composition. A silicon carbide-containing powder is blended with the metal powder, preferably in the form of a silicon carbide powder. Optionally, common alloying powders, lubricants, binding agents, and other powder metallurgy additives can be blended into the metallurgical composition. The metallurgical powder composition is used by compacting it in a die cavity to produce a “green” compact that is then sintered, preferably at relatively high temperatures.Type: ApplicationFiled: December 10, 2003Publication date: November 18, 2004Applicant: Hoeganaes CorporationInventors: Kalathur S. Narasimhan, Nikhilesh Chawla
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Patent number: 6682579Abstract: Metallurgical powder compositions are provided that include silicon carbide to enhance the strength, ductility, and machine-ability of the compacted and sintered parts made therefrom. The compositions generally contain a metal powder, such as an iron-based powder, that constitutes the major portion of the composition. A silicon carbide-containing powder is blended with the metal powder, preferably in the form of a silicon carbide powder. Optionally, common alloying powders, lubricants, binding agents, and other powder metallurgy additives can be blended into the metallurgical composition. The metallurgical powder composition is used by compacting it in a die cavity to produce a “green” compact that is then sintered, preferably at relatively high temperatures.Type: GrantFiled: November 5, 2001Date of Patent: January 27, 2004Assignee: Hoeganaes CorporationInventors: Kalathur S. Narasimhan, Nikhilesh Chawla
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Publication number: 20020073803Abstract: Metallurgical powder compositions are provided that include silicon carbide to enhance the strength, ductility, and machine-ability of the compacted and sintered parts made therefrom. The compositions generally contain a metal powder, such as an iron-based powder, that constitutes the major portion of the composition. A silicon carbide-containing powder is blended with the metal powder, preferably in the form of a silicon carbide powder. Optionally, common alloying powders, lubricants, binding agents, and other powder metallurgy additives can be blended into the metallurgical composition. The metallurgical powder composition is used by compacting it in a die cavity to produce a “green” compact that is then sintered, preferably at relatively high temperatures.Type: ApplicationFiled: November 5, 2001Publication date: June 20, 2002Applicant: Hoeganaes CorporationInventors: Kalathur S. Narasimhan, Nikhilesh Chawla
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Patent number: 6364927Abstract: Metallurgical powder compositions are provided that include silicon carbide to enhance the strength, ductility, and machine-ability of the compacted and sintered parts made therefrom. The compositions generally contain a metal powder, such as an iron-based or nickel-based powder, that constitutes the major portion of the composition. Silicon carbide is blended with the metal powder, preferably in the form of a silicon carbide powder. Optionally, common alloying powders, lubricants, binding agents, and other powder metallurgy additives can be blended into the metallurgical composition. The metallurgical powder composition is used by compacting it in a die cavity to produce a “green” compact that is then sintered, preferably at relatively high temperatures.Type: GrantFiled: April 24, 2000Date of Patent: April 2, 2002Assignee: Hoeganaes CorporationInventors: Kalathur S. Narasimhan, Nikhilesh Chawla
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Patent number: 6346133Abstract: Metallurgical powder compositions are provided that include silicon carbide to enhance the strength, ductility, and machine-ability of the compacted and sintered parts made therefrom. The compositions generally contain a metal powder, such as an iron-based or nickel-based powder, that constitutes the major portion of the composition. Silicon carbide is blended with the metal powder, preferably in the form of a silicon carbide powder. Optionally, common alloying powders, lubricants, binding agents, and other powder metallurgy additives can be blended into the metallurgical composition. The metallurgical powder composition is used by compacting it in a die cavity to produce a “green” compact that is then sintered, preferably at relatively high temperatures.Type: GrantFiled: January 10, 2000Date of Patent: February 12, 2002Assignee: Hoeganaes CorporationInventors: Kalathur S. Narasimhan, Nikhilesh Chawla