Patents by Inventor Niklas Thulin

Niklas Thulin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-stage decoupling networks integrated with on-package impedance matching networks for RF power amplifiers
    Patent number: 11228287
    Abstract: An electronic package houses one or more RF amplifier circuits. At least one of an input or output impedance matching network integrated on the package and electrically coupled to the gate or drain bias voltage connection, respectively, of an amplifier circuit, includes a multi-stage decoupling network. Each multi-stage decoupling network includes two or more decoupling stages. Each decoupling stage of the multi-stage decoupling network includes a resistance, inductance, and capacitance, and is configured to reduce impedance seen by the amplifier circuit at a different frequency below an operating band of the amplifier circuit. Bias voltage connections to the impedance matching circuits may be shared, and may be connected anywhere along the multi-stage decoupling network.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: January 18, 2022
    Assignee: Cree, Inc.
    Inventors: Madhu Chidurala, Marvin Marbell, Niklas Thulin
  • Multi-Stage Decoupling Networks Integrated with On-Package Impedance Matching Networks for RF Power Amplifiers
    Publication number: 20210399692
    Abstract: An electronic package houses one or more RF amplifier circuits. At least one of an input or output impedance matching network integrated on the package and electrically coupled to the gate or drain bias voltage connection, respectively, of an amplifier circuit, includes a multi-stage decoupling network. Each multi-stage decoupling network includes two or more decoupling stages. Each decoupling stage of the multi-stage decoupling network includes a resistance, inductance, and capacitance, and is configured to reduce impedance seen by the amplifier circuit at a different frequency below an operating band of the amplifier circuit. Bias voltage connections to the impedance matching circuits may be shared, and may be connected anywhere along the multi-stage decoupling network.
    Type: Application
    Filed: June 17, 2020
    Publication date: December 23, 2021
    Inventors: Madhu Chidurala, Marvin Marbell, Niklas Thulin