Abstract: The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt. % of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270° C.; (B) 15-22 wt. % carbon fibres; (C) 18-30 wt. % glass fibres; (D) 1-10 wt. % of an impact-resistance modifier that is different from (E) and/or polymers that are different from (A), (E) and (F); (E) 0-10 wt. % ethylene-vinyl acetate copolymer; and (F) 0-3 wt. % additives. In this way, the sum of the components (A)-(F) is 100 wt. %, the sum of the components (B)-(C) is in the range of 33-48 wt. %, and the sum of the components (D)-(E) is in the range of 2-12 wt. %. The moulding compound permits the production of dimensionally stable, electrically conductive components, e.g. for the automotive sector and for contact with fuels, in particular methanol-containing petrol.

Abstract: The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Abstract: The invention concerns polyamide moulding compound, in particular for producing heat-resistant moulded parts, having the following composition: (A) 20 to 79 wt. % of at least one partially aromatic polyamide in the form of a copolyamide which comprises 50 to 80 mol. % units formed by hexanediamine and terephthalic acid; (B) 1 to 15 wt. % of at least one impact-resistant modifier; (C) 20 to 60 wt. % of at least one carbon fibre; and (D) 0 to 5 wt. % of at least one additive, components (A) to (D) adding up to 100 wt. %.

Abstract: A molding compound consisting of the components: (A)-(E), wherein the sum of (A)-(E) makes up 100 wt. %. Component A is 40-70 wt. % of at least one partially crystalline polyamide, made up of: (a1) 60-75 wt. % of 6T units; (a2) 20-35 wt. % of 6I units; (a3) 3-15 wt. % of 612 units; (a4) 0-5 wt. % of one of the following units: 66; 68; 69; 610; 6; or a mixture of such units; wherein the sum of (a1) to (a4) makes up 100 wt. % of (A). Component (B) is 30-60 wt. % of fibrous reinforcing materials. Component (C) is 0-30 wt. % of particulate fillers different from (B), (D) and (E). Component (D) is 0-2.0 wt. % of heat stabilizers, and component (E) is 0-6 wt. % of auxiliary agents and/or additives, different from (A)-(D).

Abstract: The present invention relates to polyamide molding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to molded articles produced from these polyamide molding compounds as components in the automobile or electrics/electronics sector.

Abstract: The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

Abstract: The present invention relates to a flame-retardant polyamide moulding composition with good mechanical properties with the following constitution: (A) from 25 to 90% by weight of at least one polyamide, (B) from 5 to 60% by weight of glass fibres, where the arithmetic average of the length of these in the polyamide moulding composition is from 100 to 220 ?m, (C) from 5 to 25% by weight of at least one phosphinic salt and/or one diphosphinic salt, (D) from 0 to 20% by weight of at least one additive, where the entirety of components (A) to (D) gives 100% by weight. The invention also relates to processes for the production of moulding compositions of this type, to mouldings produced therefrom, and also to uses.

Abstract: The invention relates to a method for laser welding two plastic components A, B brought into contact at least in the joining area, wherein component B facing away from the laser radiation consists of a plastic matrix with a white pigmentation of 1.5 5-20 wt.-%, and component A facing the laser radiation, through which the laser beam passes in the welding process, exhibits a plastic matrix. For a given laser wavelength the travel distance of the laser beam through the component A measures at most 10 mm, and given a white pigmentation of the component A in wt.-%, the product of the travel distance of the laser 10 beam through the component A in mm and white pigmentation in wt.-% is less than 1.25, and the travel distance of the laser beam through the component A measures at most 1 mm.

Abstract: A polyamide molding composition and uses thereof, and moldings produced therefrom, comprising the following components: (A) semicrystalline semiaromatic polyamide with melting point above 270° C., or a mixture of these polyamides; (B) copolymer of oxyranyl acrylate and/or oxyranyl methacrylate with at least one other olefinically unsaturated monomer, or a mixture of these copolymers; (C) one or more fibrous reinforcing materials; (D) one or more heat stabilizers; where the proportion of (B) is in the range of 1 to 15% by weight, based on 100% by weight composed of the entirety of the components (A) and (B), with the proviso that the polyamide molding composition is free from grafted impact modifiers.

Abstract: Polyamide molding composition: (A) 29-89 wt % of at least one partly crystalline thermoplastic homo- or copolyamide selected from: aliphatic polyamide, cycloaliphatic polyamide, partly aromatic polyamide, or a mixture thereof, having a melting temperature (Tm) of at least 270° C. and a melting enthalpy in the range of 30-70 J/g, in particular in the range of 40-65 J/g, each measured to ISO standard 11357-3 on the granulate at a heating rate of 20° C./min; (B) 1-15 wt % of ethylene-vinyl acetate copolymer; (C) 10-70 wt % of filling and reinforcing materials selected from the following group: fibrous reinforcing materials, particulate fillers and mixtures thereof; (D) 0-20 wt % of impact modifier other than (B) and/or polymers other than (A); (E) 0-20 wt % of flame retardant; and (F) 0-5 wt % of additives, wherein the sum total of components (A)-(F) is 100 weight percent.

Abstract: Fillers are proposed, with the exception of layered silicates, which have a surface coating, which comprises a water-soluble polyamide or multiple water-soluble polyamides, wherein at least one of these water-soluble polyamides is produced by polycondensation from monomer components, which comprise at least one dicarboxylic acid and at least one selected ether diamine, preferably having linear oxypropyl amino end groups. Fillers coated in this manner are suitable for use in the production of filled and/or reinforced thermoplastic plastics molding materials. Thermoplastic plastics molding materials which contain fillers having such a surface coating have good mechanical properties and few emissions (low outgassing).

Abstract: The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on (A) from 30 to 92% by weight of at least one aliphatic or semiaromatic, semicrystalline polyamide with melting point (Tm) in the range from 240° C. to 340° C.; (B) from 0 to 50% by weight of at least one filler and reinforcing agent; (C) from 8 to 18% by weight of at least one halogen-free flame retardant; (D) from 0 to 2.0% by weight of at least one barium carboxylate; (E) from 0 to 5% by weight of at least one additive; wherein the percentages by weight of components (A) to (E) give a total of 100%, and with the proviso that if the proportion of component (D) is in the range from 0 to 0.1% by weight the halogen-free flame retardant of component (C) is based on a barium phosphinate.

Abstract: The present invention relates to polyamide molding compounds, pigmented black, which include nigrosin and at least one nucleation agent, carbon black being ruled out. The present invention likewise relates to a method for producing molded articles from the mentioned polyamide molding compounds and also the corresponding molded articles. The polyamide molding compounds are used in the production of components with increased temperature requirements, e.g. in the automobile sector.

Abstract: What is described is a polyamide molding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components (A) 40 to 80% by weight of at least one semiaromatic polyamide based on at least 70 mol % of aromatic dicarboxylic acids and at least 70 mol % of aliphatic diamines having 4 to 18 carbon atoms and having a melting temperature in the range from 270° C. to 340° C. (B) 10 to 30% by weight of titanium dioxide particles (C) 5 to 20% by weight of glass fibres (D) 5-30% by weight of calcium carbonate. The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.

Abstract: Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %.

Abstract: Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %.

Abstract: The present invention relates to reinforced polyamide molding compounds containing high-melting partially aromatic polyamides and flat glass fibers, in particular with a rectangular cross section, i.e., glass fibers with a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compounds and molded articles manufactured therefrom, i.e., in particular injection-molded parts. The inventive molded parts have a high transverse stiffness and transverse strength.

Abstract: Filled polyamide molding compounds which, in addition to a selected polymer mixture comprising polyamides and a flameproofing agent, contain glass fibers with non-circular cross-sections, the use of such molding compounds for the production of molded articles, and the molded articles themselves.

Abstract: The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on (A) from 30 to 92% by weight of at least one aliphatic or semiaromatic, semicrystalline polyamide with melting point (Tm) in the range from 240° C. to 340° C.; (B) from 0 to 50% by weight of at least one filler and reinforcing agent; (C) from 8 to 18% by weight of at least one halogen-free flame retardant; (D) from 0 to 2.0% by weight of at least one barium carboxylate; (E) from 0 to 5% by weight of at least one additive; wherein the percentages by weight of components (A) to (E) give a total of 100%, and with the proviso that if the proportion of component (D) is in the range from 0 to 0.1% by weight the halogen-free flame retardant of component (C) is based on a barium phosphinate.

Abstract: A polyamide molding composition is described, comprising at least one transparent polyesteramide in a proportion by weight of from 70 to 99.99% by weight; at least one further polymer in a proportion by weight of from 0 to 30% by weight; at least one photochromic dye in a proportion by weight of from 0.01 to 2% by weight; and also optionally further dyes and/or additives. The invention further encompasses articles manufactured therefrom, e.g. foils, for the coating of photochromic ophthalmic lenses, or the like.