Abstract: The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt. % of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270° C.; (B) 15-22 wt. % carbon fibres; (C) 18-30 wt. % glass fibres; (D) 1-10 wt. % of an impact-resistance modifier that is different from (E) and/or polymers that are different from (A), (E) and (F); (E) 0-10 wt. % ethylene-vinyl acetate copolymer; and (F) 0-3 wt. % additives. In this way, the sum of the components (A)-(F) is 100 wt. %, the sum of the components (B)-(C) is in the range of 33-48 wt. %, and the sum of the components (D)-(E) is in the range of 2-12 wt. %. The moulding compound permits the production of dimensionally stable, electrically conductive components, e.g. for the automotive sector and for contact with fuels, in particular methanol-containing petrol.

Abstract: The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Abstract: The invention concerns polyamide moulding compound, in particular for producing heat-resistant moulded parts, having the following composition: (A) 20 to 79 wt. % of at least one partially aromatic polyamide in the form of a copolyamide which comprises 50 to 80 mol. % units formed by hexanediamine and terephthalic acid; (B) 1 to 15 wt. % of at least one impact-resistant modifier; (C) 20 to 60 wt. % of at least one carbon fibre; and (D) 0 to 5 wt. % of at least one additive, components (A) to (D) adding up to 100 wt. %.

Abstract: A molding compound consisting of the components: (A)-(E), wherein the sum of (A)-(E) makes up 100 wt. %. Component A is 40-70 wt. % of at least one partially crystalline polyamide, made up of: (a1) 60-75 wt. % of 6T units; (a2) 20-35 wt. % of 6I units; (a3) 3-15 wt. % of 612 units; (a4) 0-5 wt. % of one of the following units: 66; 68; 69; 610; 6; or a mixture of such units; wherein the sum of (a1) to (a4) makes up 100 wt. % of (A). Component (B) is 30-60 wt. % of fibrous reinforcing materials. Component (C) is 0-30 wt. % of particulate fillers different from (B), (D) and (E). Component (D) is 0-2.0 wt. % of heat stabilizers, and component (E) is 0-6 wt. % of auxiliary agents and/or additives, different from (A)-(D).

Abstract: The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt. % of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270° C.; (B) 15-22 wt. % carbon fibres; (C) 18-30 wt. % glass fibres; (D) 1-10 wt. % of an impact-resistance modifier that is different from (E) and/or polymers that are different from (A), (E) and (F); (E) 0-10 wt. % ethylene-vinyl acetate copolymer; and (F) 0-3 wt. % additives. In this way, the sum of the components (A)-(F) is 100 wt. %, the sum of the components (B)-(C) is in the range of 33-48 wt. %, and the sum of the components (D)-(E) is in the range of 2-12 wt. %. The moulding compound permits the production of dimensionally stable, electrically conductive components, e.g. for the automotive sector and for contact with fuels, in particular methanol-containing petrol.

Abstract: The present invention refers to a polyamide moulding composition consisting of the following components: (A) 30 to 79.7% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 20 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines, cycloaliphatic diamines and araliphatic diamines, (B) 0 to 10% by weight of at least one polyamide different from component (A) (C) 20 to 55% by weight of at least one fibrous reinforcing agent, (D) 0.2 to 2.0% by weight of nigrosine, (E) 0.1 to 3.0% by weight of at least one heat stabilizer, (F) 0 to 10% by weight of a at least one additive, whereby the entirety of components (A) to (F) add up to 100% by weight.

Abstract: The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Abstract: The present invention relates to polyamide molding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to molded articles produced from these polyamide molding compounds as components in the automobile or electrics/electronics sector.

Abstract: The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

Abstract: The present invention relates to a flame-retardant polyamide moulding composition with good mechanical properties with the following constitution: (A) from 25 to 90% by weight of at least one polyamide, (B) from 5 to 60% by weight of glass fibres, where the arithmetic average of the length of these in the polyamide moulding composition is from 100 to 220 ?m, (C) from 5 to 25% by weight of at least one phosphinic salt and/or one diphosphinic salt, (D) from 0 to 20% by weight of at least one additive, where the entirety of components (A) to (D) gives 100% by weight. The invention also relates to processes for the production of moulding compositions of this type, to mouldings produced therefrom, and also to uses.

Abstract: The invention relates to a method for laser welding two plastic components A, B brought into contact at least in the joining area, wherein component B facing away from the laser radiation consists of a plastic matrix with a white pigmentation of 1.5 5-20 wt.-%, and component A facing the laser radiation, through which the laser beam passes in the welding process, exhibits a plastic matrix. For a given laser wavelength the travel distance of the laser beam through the component A measures at most 10 mm, and given a white pigmentation of the component A in wt.-%, the product of the travel distance of the laser 10 beam through the component A in mm and white pigmentation in wt.-% is less than 1.25, and the travel distance of the laser beam through the component A measures at most 1 mm.

Abstract: A polyamide molding composition and uses thereof, and moldings produced therefrom, comprising the following components: (A) semicrystalline semiaromatic polyamide with melting point above 270° C., or a mixture of these polyamides; (B) copolymer of oxyranyl acrylate and/or oxyranyl methacrylate with at least one other olefinically unsaturated monomer, or a mixture of these copolymers; (C) one or more fibrous reinforcing materials; (D) one or more heat stabilizers; where the proportion of (B) is in the range of 1 to 15% by weight, based on 100% by weight composed of the entirety of the components (A) and (B), with the proviso that the polyamide molding composition is free from grafted impact modifiers.

Abstract: A polyamide moulding compound consisting of the following components (A)-(E): (A) 40-70 wt. % of at least one partially crystalline, partially aromatic polyamide, made up of: (a1) 60 to 75 wt. % of 6T units, formed from 1,6-hexanediamine and terephthalic acid; (a2) 20 to 35 wt. % of 6I units, formed from 1,6-hexanediamine and isophthalic acid; (a3) 3 to 15 wt. % of 612 units, formed from 1,6-hexanediamine and dodecanedioic acid; and (a4) 0 to 5 wt. % of one of the following units: 66 units, formed from 1,6-hexanediamine and adipic acid; 68 units, formed from 1,6-hexane-diamine and suberic acid; 69 units formed from 1,6-hexanediamine and azelaic acid; 610 units formed from 1,6-hexanediamine and sebacic acid; 6 units formed from ?-caprolactam; or a mixture of such units; wherein the sum of the components (a1) to (a4) makes up 100 wt. % of the polyamide (A); (B) 30-60 wt. % of fibrous reinforcing materials; (C) 0-30 wt. % of particulate fillers different from (B), (D) and (E); (D) 0-2.0 wt.

Abstract: Polyamide molding composition: (A) 29-89 wt % of at least one partly crystalline thermoplastic homo- or copolyamide selected from: aliphatic polyamide, cycloaliphatic polyamide, partly aromatic polyamide, or a mixture thereof, having a melting temperature (Tm) of at least 270° C. and a melting enthalpy in the range of 30-70 J/g, in particular in the range of 40-65 J/g, each measured to ISO standard 11357-3 on the granulate at a heating rate of 20° C./min; (B) 1-15 wt % of ethylene-vinyl acetate copolymer; (C) 10-70 wt % of filling and reinforcing materials selected from the following group: fibrous reinforcing materials, particulate fillers and mixtures thereof; (D) 0-20 wt % of impact modifier other than (B) and/or polymers other than (A); (E) 0-20 wt % of flame retardant; and (F) 0-5 wt % of additives, wherein the sum total of components (A)-(F) is 100 weight percent.

Abstract: Fillers are proposed, with the exception of layered silicates, which have a surface coating, which comprises a water-soluble polyamide or multiple water-soluble polyamides, wherein at least one of these water-soluble polyamides is produced by polycondensation from monomer components, which comprise at least one dicarboxylic acid and at least one selected ether diamine, preferably having linear oxypropyl amino end groups. Fillers coated in this manner are suitable for use in the production of filled and/or reinforced thermoplastic plastics molding materials. Thermoplastic plastics molding materials which contain fillers having such a surface coating have good mechanical properties and few emissions (low outgassing).

Abstract: The invention concerns polyamide moulding compound, in particular for producing heat-resistant moulded parts, having the following composition: (A) 20 to 79 wt. % of at least one partially aromatic polyamide in the form of a copolyamide which comprises 50 to 80 mol. % units formed by hexanediamine and terephthalic acid; (B) 1 to 15 wt. % of at least one impact-resistant modifier; (C) 20 to 60 wt. % of at least one carbon fibre; and (D) 0 to 5 wt. % of at least one additive, components (A) to (D) adding up to 100 wt. %.

Abstract: The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Abstract: The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on (A) from 30 to 92% by weight of at least one aliphatic or semiaromatic, semicrystalline polyamide with melting point (Tm) in the range from 240° C. to 340° C.; (B) from 0 to 50% by weight of at least one filler and reinforcing agent; (C) from 8 to 18% by weight of at least one halogen-free flame retardant; (D) from 0 to 2.0% by weight of at least one barium carboxylate; (E) from 0 to 5% by weight of at least one additive; wherein the percentages by weight of components (A) to (E) give a total of 100%, and with the proviso that if the proportion of component (D) is in the range from 0 to 0.1% by weight the halogen-free flame retardant of component (C) is based on a barium phosphinate.

Abstract: Polyamide moulding composition consisting of the following components: (A) 29-89 wt % of at least one partly crystalline thermoplastic homo- or copolyamide selected from the following group: aliphatic polyamide, cycloaliphatic polyamide, partly aromatic polyamide, or a mixture thereof, having a melting temperature (Tm) of at least 270° C. and a melting enthalpy in the range of 30-70 J/g, in particular in the range of 40-65 J/g, each measured to ISO standard 11357-3 on the granulate at a heating rate of 20° C./min; (B) 1-15 wt % of ethylene-vinyl acetate copolymer; (C) 10-70 wt % of filling and reinforcing materials selected from the following group: fibrous reinforcing materials, particulate fillers and mixtures thereof; (D) 0-20 wt % of impact modifier other than (B) and/or polymers other than (A); (E) 0-20 wt % of flame retardant; and (F) 0-5 wt % of additives, wherein the sum total of components (A)-(F) is 100 weight percent.

Abstract: Fillers are proposed, with the exception of layered silicates, which have a surface coating, which comprises a water-soluble polyamide or multiple water-soluble polyamides, wherein at least one of these water-soluble polyamides is produced by polycondensation from monomer components, which comprise at least one dicarboxylic acid and at least one selected ether diamine, preferably having linear oxypropyl amino end groups. Fillers coated in this manner are suitable for use in the production of filled and/or reinforced thermoplastic plastics molding materials. Thermoplastic plastics molding materials which contain fillers having such a surface coating have good mechanical properties and few emissions (low outgassing).