Abstract: Disclosed is a method for producing rotary sputtering target assemblies that are bonded to a suitable backing support. The bonding between the sputtering target body and the backing support is achieved by controlled heating under a suitable temperature, preferably with the help of conductive layer between the induction heater and internal target body that is inductively heated in a manner that enhances axial and radial gradient heating. A non-adhesive protective wrap can also be placed at the target body such as between the conductive wrap and target body.

Abstract: A target assembly comprising—a support body having a carrying surface; —a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface, —wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.

Abstract: A sputtering target assembly formed by relative positioning of a sputtering target body or bodies and a backing support, such that the backing support is placed within the inside diameter of the sputtering target body. The combination is heated with an induction heater surrounding the target body so that there is achieved a suitable temperature for bonding. Heating is discontinued such that there is a cooling of the bonding material and a bonding relationship established between the sputtering target body (or bodies) and the backing support. Embodiments include adding a conductive layer, as in a conductive fabric wrap, between the induction heater and internal target body(ies) that is/are inductively heated in a manner that enhances axial and radial gradient heating during bonding. The conductive wrap can be used with a low conductivity material as in an LiMO2 (e.g., Li—CoO2) target body.

Abstract: A target assembly comprising—a support body having a carrying surface;—a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface,—wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.

Abstract: A sputtering target precursor material comprises a homogeneous distribution of a ZnAl2O4 phase in a hexagonal ZnO phase, said ZnO phase further comprises less than 1 wt % of elemental Al in solid solution, expressed versus the total weight of said target material.