Abstract: A thin-film Light Emitting Diode (LED) and methods of manufacturing the same are disclosed. Specifically, the thin-film LED is provided with an epitaxial layer having a proton implantation that controls the size of the active volume. Controlling the size of the active volume enables the thin-film LED to enjoy decreased rise and fall times, thereby achieving a thin-film LED that is useable for transmission in high transmission rate communication systems.

Abstract: A two-sided-access (TSA) eWLB is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the eWLB package. When fabricating the IC die wafer, metal stamps are formed in the IC die wafer in contact with the rear faces of the IC dies. When the IC dies are subsequently reconstituted in an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawed to singulate the TSA eWLB packages and the packages are mounted on PCBs, any electrical contact pad that is disposed on the rear face of the IC die can be accessed via the respective metal stamp of the IC die.

Abstract: An optical data communication module assembly includes a mountable module body, a fiber guide tube having one end attached to the module body, and a fiber clamp sleeve having a barrel retained within the other end of the fiber guide tube. The interior of the fiber guide tube and exterior of the fiber clamp sleeve have correspondingly tapered diameters and mating engagements. Sliding the fiber clamp sleeve within the fiber guide tube can engage and disengage these mating engagements and also clamp and unclamp an optical fiber within the fiber guide tube.

Abstract: A two-sided-access (TSA) eWLB is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the eWLB package. When fabricating the IC die wafer, metal stamps are formed in the IC die wafer in contact with the rear faces of the IC dies. When the IC dies are subsequently reconstituted in an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawed to singulate the TSA eWLB packages and the packages are mounted on PCBs, any electrical contact pad that is disposed on the rear face of the IC die can be accessed via the respective metal stamp of the IC die.

Abstract: A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe.

Abstract: A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe.

Abstract: An optical data communication module, such as a transceiver, transmitter or receiver, has two parallel substrates with metal layers. An opto-electronic device between the substrates is shielded against electromagnetic interference by the metal layers and conductors, such as vias, which are distributed around a periphery of the opto-electronic device and connect the metal layers.

Abstract: An optical fiber connector includes a connector body and a submodule having a user-selectable configuration, such as a splitter or coupler. The connector body has a submodule mounting region. A first end of the connector body has a pluggable optical fiber port. A second end of the connector body has at least one body fiber guide. The submodule is releasably mounted in the submodule mounting region. The submodule has at least one submodule fiber guide aligned with at least one body fiber guide and at least one submodule fiber guide aligned with the pluggable optical fiber port. One or more optical fibers are routed through the connector body in accordance with the submodule configuration.

Abstract: A thin-film Light Emitting Diode (LED) and methods of manufacturing the same are disclosed. Specifically, the thin-film LED is provided with an epitaxial layer having a proton implantation that controls the size of the active volume. Controlling the size of the active volume enables the thin-film LED to enjoy decreased rise and fall times, thereby achieving a thin-film LED that is useable for transmission in high transmission rate communication systems.

Abstract: An optical data communication module assembly includes a mountable module body, a fiber guide tube having one end attached to the module body, and a fiber clamp sleeve having a barrel retained within the other end of the fiber guide tube. The interior of the fiber guide tube and exterior of the fiber clamp sleeve have correspondingly tapered diameters and mating engagements. Sliding the fiber clamp sleeve within the fiber guide tube can engage and disengage these mating engagements and also clamp and unclamp an optical fiber within the fiber guide tube.

Abstract: An optical data communication module, such as a transceiver, transmitter or receiver, has two parallel substrates with metal layers. An opto-electronic device between the substrates is shielded against electromagnetic interference by the metal layers and conductors, such as vias, which are distributed around a periphery of the opto-electronic device and connect the metal layers.

Abstract: A two-sided-access (TSA) eWLB is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the eWLB package. When fabricating the IC die wafer, metal stamps are formed in the IC die wafer in contact with the rear faces of the IC dies. When the IC dies are subsequently reconstituted in an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawed to singulate the TSA eWLB packages and the packages are mounted on PCBs, any electrical contact pad that is disposed on the rear face of the IC die can be accessed via the respective metal stamp of the IC die.

Abstract: In an opto-isolator, a nontransparent hollow tube having a smooth inner surface with mirror-like qualities is used as the optical waveguide for coupling optical signals between the transmitter module and the receiver module and for providing electrical transient isolation.

Abstract: An FOT module is provided that has a molded cover in which an optical beam transformer is integrally formed. The molded cover includes at least a nontransparent molded part that is secured to a mounting structure, such as a molded leadframe or a PCB, on which at least one active optical device is mounted. The material of which the nontransparent molded part is made has a CTE that matches, or nearly matches, the CTE of the body of the mounting structure. Consequently, exposure of the FOT module to temperature variations will not result in delaminations at the interface of the mounting structure and the nontransparent molded part.

Abstract: An optical signal representing digital data is produced by an opto-electronic semiconductor device having a group of three or more opto-electronic light sources that emit optical signals in accordance with a pulse amplitude modulation (PAM) scheme. The optical signal can be transmitted through an optical fiber coupled to an assembly containing the opto-electronic semiconductor device.

Abstract: A 2-to-1 POF optical coupler, a bi-directional link that employs the coupler, and methods for performing 2-to-1 optical coupling are provided, wherein the 2-to-1 POF optical coupler is configured to provide a carefully-selected amount of cross-sectional overlap at the interface between the end face of a main POF or POF pigtail and the end face of the coupler. The amount of overlap is selected to ensure that optical coupling losses are reduced and optical efficiency is increased in both directions in a bi-directional optical communications links. Consequently, signal integrity is improved, limitations on link length are relaxed, and overall link performance is improved while, at the same time, overall link costs are reduced.

Abstract: A half-duplex, single-fiber (S-F) optical transceiver module is provided in which a light source, such as a laser diode or a light-emitting diode (LED), is mounted on an edge region of a photodiode to increase the amount of surface area of the photodiode that is available for absorbing light received in the optical transceiver module. The S-F optical transceiver module has a relatively simple optical coupling system for coupling light between an end face of an optical fiber and the photodiode and laser diode or LED with high optical coupling efficiency and reduced optical crosstalk.

Abstract: D-shaped POFs are used to form a 2-to-1 optical coupler. The D-shaped POFs are produced via an extrusion process that is relatively inexpensive to perform and that can be performed with relatively high manufacturing throughput. The D-shaped POFs are bonded together to form a coupler end face having a generally circular cross-sectional area. The coupler end face is interfaced with an end face of a main POF that is generally circular in cross-sectional shape. The resulting D-shaped 2-to-1 optical POF couplers have relatively low insertion loss and relatively high optical coupling efficiency.

Abstract: An optical signal representing digital data is produced by an opto-electronic semiconductor device having a group of three or more opto-electronic light sources that emit optical signals in accordance with a pulse amplitude modulation (PAM) scheme. The optical signal can be transmitted through an optical fiber coupled to an assembly containing the opto-electronic semiconductor device.

Abstract: An FOT module is provided that has a molded cover in which an optical beam transformer is integrally formed. The molded cover includes at least a nontransparent molded part that is secured to a mounting structure, such as a molded leadframe or a PCB, on which at least one active optical device is mounted. The material of which the nontransparent molded part is made has a CTE that matches, or nearly matches, the CTE of the body of the mounting structure. Consequently, exposure of the FOT module to temperature variations will not result in delaminations at the interface of the mounting structure and the nontransparent molded part.