Abstract: In an embodiment, a lithographic apparatus is disclosed that includes a modulator configured to expose an exposure area of the substrate to a plurality of beams modulated according to a desired pattern and a projection system configured to project the modulated beams onto the substrate. The modulator includes a deflector to displace the plurality of beams with respect to an exposure area.

Abstract: Methods and systems for inspection of an object include the use of spectroscopic techniques for the detection of unwanted particles on an object's surface, based on the different responses of the unwanted particles as compared with the object to be inspected due to their different materials. Time resolved spectroscopy and/or energy resolved spectroscopy of secondary photon emission from the surface of the object can be used to obtain Raman and photoluminescence spectra. The objects to be inspected can for example be a patterning device as used in a lithographic process, for example a reticle, in which case the presence of metal, metal oxide or organic particles can be detected, for example. The methods and apparatus are highly sensitive, for example, being able to detect small particles (sub 100 nm, particularly sub 50 nm) on the patterned side of an EUV reticle.

Abstract: A lithographic method, among things is disclosed. The method includes using information at least indicative of a desired shape or size of a constituent part of a device to implement the desired shape or size of the constituent part of the device, the desired shape or size being related to a measured property of a layer of material in which the constituent part of the device is to be created, at least a part of the implementation comprising determining a configuration of a plurality of individually controllable elements that would be necessary to create in a radiation beam a pattern which is sufficient to implement the desired shape or size of the constituent part of the device when creating the constituent part of the device.

Abstract: In an embodiment, a lithographic apparatus is disclosed that includes a modulator configured to expose an exposure area of the substrate to a plurality of beams modulated according to a desired pattern and a projection system configured to project the modulated beams onto the substrate. The modulator includes a deflector to displace the plurality of beams with respect to an exposure area.

Abstract: A lithographic method includes providing particles in dry form on a substrate, or on material provided on the substrate, irradiating one or more of the particles with a dose of radiation, the dose of radiation being sufficient to ensure that at least one particle of the one or more particles is bonded to the substrate, or to the material provided on the substrate, and removing particles from the substrate, or from material provided on the substrate, that have not been bonded to the substrate, or to the material provided on the substrate.

Abstract: An electronic device comprises an in-plane component formed in an organic semiconductor layer, desirably graphene, on a flexible substrate. The component is formed using imprint lithography to create a trench through the organic semiconductor layer in a roll-to-roll process. The number of process steps required is limited to allow manufacture of the device in a single integrated apparatus.

Abstract: Methods and systems for inspection of an object include the use of spectroscopic techniques for the detection of unwanted particles on an object's surface, based on the different responses of the unwanted particles as compared with the object to be inspected due to their different materials. Time resolved spectroscopy and/or energy resolved spectroscopy of secondary photon emission from the surface of the object can be used to obtain Raman and photoluminescence spectra. The objects to be inspected can for example be a patterning device as used in a lithographic process, for example a reticle, in which case the presence of metal, metal oxide or organic particles can be detected, for example. The methods and apparatus are highly sensitive, for example, being able to detect small particles (sub 100 nm, particularly sub 50 nm) on the patterned side of an EUV reticle.

Abstract: A lithographic method, among things is disclosed. The method includes using information at least indicative of a desired shape or size of a constituent part of a device to implement the desired shape or size of the constituent part of the device, the desired shape or size being related to a measured property of a layer of material in which the constituent part of the device is to be created, at least a part of the implementation comprising determining a configuration of a plurality of individually controllable elements that would be necessary to create in a radiation beam a pattern which is sufficient to implement the desired shape or size of the constituent part of the device when creating the constituent part of the device.

Abstract: A lithographic method includes providing particles in dry form on a substrate, or on material provided on the substrate, irradiating one or more of the particles with a dose of radiation, the dose of radiation being sufficient to ensure that at least one particle of the one or more particles is bonded to the substrate, or to the material provided on the substrate, and removing particles from the substrate, or from material provided on the substrate, that have not been bonded to the substrate, or to the material provided on the substrate.