Abstract: Ceramic assembly can comprise a ceramic article comprising a thickness defined between a first major surface and a second major surface. The thickness can be about 100 micrometers or less. The ceramic assembly can comprise a polymer coating deposited over at least an outer peripheral portion of the first major surface of the ceramic article. The polymer coating can comprise a thickness of about 30 micrometers or less. An edge strength of the ceramic assembly can be greater than an edge strength of the ceramic article by about 50 MegaPascals or more. Methods of forming a ceramic assembly can comprise depositing a polymer coating on an outer peripheral portion of a first major surface of a ceramic article. Methods can further comprise curing the polymer coating.

Abstract: A method of depositing a copper film on a major surface of a glass sheet includes determining a desired range of a property of the copper film, correlating a thermal history of the glass sheet to the desired range of the property of the copper film, and depositing the copper film on the major surface of the glass sheet, wherein the property of the copper film deposited on the glass sheet is within the desired range. Correlating the thermal history of the glass sheet to the desired range of the property of the copper film can include heat treating glass sheet prior to depositing the copper film on the glass sheet.

Abstract: A thin-film transistor (TFT), includes: a substrate (202); an organic semiconductor (OSC) layer (210) positioned on the substrate; a dielectric layer (214) positioned on the OSC layer; and a polymeric interlayer (212) disposed in-between the OSC layer and the dielectric layer, such that the dielectric layer is configured to exhibit a double layer capacitance effect. A method of forming a thin-film transistor, includes: providing a substrate; providing a bottom gate layer atop the substrate; disposing consecutively from the substrate, an organic semiconductor (OSC) layer, a dielectric layer, and a top gate layer; and patterning the OSC layer, the dielectric layer, and the top gate layer using a single mask.

Abstract: A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material.

Abstract: A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material

Abstract: Disclosed devices (100) include a liquid crystal layer (140), a cover glass (105), a polarizer (115), and at least one anti-static coating disposed on at least one major surface (105A, 105C) of the cover glass, at least one major surface (115A, 115C) of the polarizer, or both. Methods for reducing mura (light leakage) in a touch-display device by means of this anti-static coating are also disclosed.

Abstract: Ceramic assembly can comprise a ceramic article comprising a thickness defined between a first major surface and a second major surface. The thickness can be about 100 micrometers or less. The ceramic assembly can comprise a polymer coating deposited over at least an outer peripheral portion of the first major surface of the ceramic article. The polymer coating can comprise a thickness of about 30 micrometers or less. An edge strength of the ceramic assembly can be greater than an edge strength of the ceramic article by about 50 MegaPascals or more. Methods of forming a ceramic assembly can comprise depositing a polymer coating on an outer peripheral portion of a first major surface of a ceramic article. Methods can further comprise curing the polymer coating.

Abstract: Methods of processing or modifying a glass substrate such as a glass sheet are disclosed. A method includes contacting at least one of opposing major surfaces of the glass sheet with a fluid applicator apparatus and a liquid etchant composition including acetic acid, ammonium fluoride, and water, the contacting conducted at a predetermined transfer rate of the liquid etchant to the at least one of the opposing major surfaces. The predetermined liquid transfer rate is controlled to adjustably texture the at least one of the opposing major surfaces and provide a textured major surface, wherein when the textured major surface and a planar surface are placed in contact, there is an adhesion force between the textured major surface and the planar surface, and wherein the adhesion force is within a target adhesion force range.

Abstract: A polar elastomer dielectric layer is formed on a substrate by dynamically dispensing a solution containing the polar elastomer on the substrate and curing it at an elevated temperature. The polar elastomer can include poly(vinylidene fluoride-co-hexa-fluoropropylene) (e-PVDF-HFP). They dynamic dispensing process can include spinning the substrate at a first speed, depositing the polar elastomer solution on the substrate, and spinning the substrate at a second speed.