Patents by Inventor Nikunj P. Patel

Nikunj P. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SINTERED HEAT SPREADERS WITH INSERTS
    Publication number: 20190027379
    Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.
    Type: Application
    Filed: November 16, 2015
    Publication date: January 24, 2019
    Applicant: Intel Corporation
    Inventors: Wei Hu, Aravindha R. Antoniswamy, Thomas J. Fitzgerald, Nikunj P. Patel, Syadwad Jain, Zhizhong Tang, Shrenik Kothari
  • Multi-component integrated heat spreader for multi-chip packages
    Patent number: 9330999
    Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: May 3, 2016
    Assignee: Intel Corporation
    Inventors: Thomas J. Fitzgerald, Aravindha R. Antoniswamy, Carl L. Deppisch, Nikunj P. Patel
  • MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
    Publication number: 20150357258
    Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 10, 2015
    Applicant: Intel Corporation
    Inventors: Thomas J. Fitzgerald, Aravindha R. Antoniswamy, Carl L. Deppisch, Nikunj P. Patel