Patents by Inventor Nilanjan Palit
Nilanjan Palit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250076954Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.Type: ApplicationFiled: September 12, 2024Publication date: March 6, 2025Inventors: Vivek GARG, Ankush VARMA, Krishnakanth SISTLA, Nikhil GUPTA, Nikethan Shivanand BALIGAR, Stephen WANG, Nilanjan PALIT, Timothy Yee-Kwong KAM, Adwait PURANDARE, Ujjwal GUPTA, Stanley CHEN, Dorit SHAPIRA, Shruthi VENUGOPAL, Suresh CHEMUDUPATI, Rupal PARIKH, Eric DEHAEMER, Pavithra SAMPATH, Phani Kumar KANDULA, Yogesh BANSAL, Dean MULLA, Michael TULANOWSKI, Stephen Paul HAAKE, Andrew HERDRICH, Ripan DAS, Nazar Syed HAIDER, Aman SEWANI
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Publication number: 20250013493Abstract: Examples described herein relate to circuitry to: monitor utilization data for a plurality of processes; determine one or more priority levels associated with at least one of the plurality of processes based on policy parameters; and adjust a frequency of operation of the interface circuitry based on the monitored utilization data and the determined priority levels of the processes. In some examples, adjust the frequency of operation of the interface circuitry is to prioritize frequency of operation requested by a higher priority workload over a frequency of operations requested by a lower priority workload.Type: ApplicationFiled: September 18, 2024Publication date: January 9, 2025Inventors: Chris MACNAMARA, John J. BROWNE, Nilanjan PALIT, Chetan HIREMATH, Rory SEXTON, Conor WALSH, Kevin LAATZ, Andriy GLUSTSOV, Peter McCARTHY, Katelyn DONNELLAN, Vishal DEEP AJMERA, David HUNT, Gordon NOONAN
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Publication number: 20250004536Abstract: Techniques and mechanisms for determining operation a processor core which is in a common power delivery domain with one or more other processor cores. In an embodiment, an execution of instructions by a first core of a processor module is selectively throttled based on the detection of a single violation condition. The throttling is performed while the cores of the processor module are each maintained in a current power state. The single violation condition comprises a violation of a test criteria by the first core, while the one or more other cores of the module each satisfy the test criteria. In the case of a multiple violation condition, each core of the processor module is transitioned from one power state to another power state. In another embodiment, the test criteria includes or is otherwise based on a threshold level of a dynamic capacitance for a given core.Type: ApplicationFiled: June 29, 2023Publication date: January 2, 2025Applicant: Intel CorporationInventors: Adwait Purandare, Ankush Varma, Nilanjan Palit, Yuval Bustan, Eran Barnett, Eliezer Weissman, Stanley Chen, Arjan Van De Ven
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Patent number: 12093100Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.Type: GrantFiled: September 26, 2020Date of Patent: September 17, 2024Assignee: Intel CorporationInventors: Vivek Garg, Ankush Varma, Krishnakanth Sistla, Nikhil Gupta, Nikethan Shivanand Baligar, Stephen Wang, Nilanjan Palit, Timothy Yee-Kwong Kam, Adwait Purandare, Ujjwal Gupta, Stanley Chen, Dorit Shapira, Shruthi Venugopal, Suresh Chemudupati, Rupal Parikh, Eric Dehaemer, Pavithra Sampath, Phani Kumar Kandula, Yogesh Bansal, Dean Mulla, Michael Tulanowski, Stephen Paul Haake, Andrew Herdrich, Ripan Das, Nazar Syed Haider, Aman Sewani
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Publication number: 20240273028Abstract: Examples described herein relate to at least one multi-core processor and a circuitry can determine and output energy usage of a process regardless of a core of the at least one multi-core processor that executes the process. The circuitry can determine the energy usage of the process based on cache operations and processor microoperations associated with the process. The energy usage of the process can be based on dynamic capacitance (Cdyn) levels and one or more of: temperature of the at least one multi-core processor, input voltage temperature to the at least one multi-core processor, and/or frequency of the at least one multi-core processor.Type: ApplicationFiled: March 8, 2024Publication date: August 15, 2024Inventors: Corey D. GOUGH, Yuval BUSTAN, Arvind RAMAN, Mariusz ORIOL, Nilanjan PALIT, Philip ABRAHAM, Priyanka GANESH, Daniel G. CARTAGENA, Mateusz DUCHALSKI
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Patent number: 11886918Abstract: An apparatus and method for intelligently scheduling threads across a plurality of logical processors. For example, one embodiment of a processor comprises: a plurality of cores; one or more peripheral component interconnects to couple the plurality of cores to memory, and in response to a core configuration command to deactivate a core of the plurality of cores, a region within the memory is updated with an indication of deactivation of the core.Type: GrantFiled: April 11, 2022Date of Patent: January 30, 2024Assignee: INTEL CORPORATIONInventors: Ankush Varma, Nikhil Gupta, Vasudevan Srinivasan, Krishnakanth Sistla, Nilanjan Palit, Abhinav Karhu, Eugene Gorbatov, Eliezer Weissmann
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Publication number: 20220244996Abstract: An apparatus and method for intelligently scheduling threads across a plurality of logical processors. For example, one embodiment of a processor comprises: a plurality of cores; one or more peripheral component interconnects to couple the plurality of cores to memory, and in response to a core configuration command to deactivate a core of the plurality of cores, a region within the memory is updated with an indication of deactivation of the core.Type: ApplicationFiled: April 11, 2022Publication date: August 4, 2022Inventors: Ankush VARMA, Nikhil GUPTA, Vasudevan SRINIVASAN, Krishnakanth SISTLA, Nilanjan PALIT, Abhinav KARHU, Eugene GORBATOV, Eliezer WEISSMANN
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Patent number: 11301298Abstract: An apparatus and method for intelligently scheduling threads across a plurality of logical processors.Type: GrantFiled: March 28, 2020Date of Patent: April 12, 2022Assignee: INTEL CORPORATIONInventors: Ankush Varma, Nikhil Gupta, Vasudevan Srinivasan, Krishnakanth Sistla, Nilanjan Palit, Abhinav Karhu, Eugene Gorbatov, Eliezer Weissmann
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Publication number: 20220100247Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.Type: ApplicationFiled: September 26, 2020Publication date: March 31, 2022Applicant: Intel CorporationInventors: Vivek Garg, Ankush Varma, Krishnakanth Sistla, Nikhil Gupta, Nikethan Shivanand Baligar, Stephen Wang, Nilanjan Palit, Timothy Kam, Adwait Purandare, Ujjwal Gupta, Stanley Chen, Dorit Shapira, Shruthi Venugopal, Suresh Chemudupati, Rupal Parikh, Eric Dehaemer, Pavithra Sampath, Phani Kumar Kandula, Yogesh Bansal, Dean Mulla, Michael Tulanowski, Stephen Haake, Andrew Herdrich, Ripan Das
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Publication number: 20210303357Abstract: An apparatus and method for intelligently scheduling threads across a plurality of logical processors.Type: ApplicationFiled: March 28, 2020Publication date: September 30, 2021Inventors: Ankush VARMA, Nikhil GUPTA, Vasudevan SRINIVASAN, Krishnakanth SISTLA, Nilanjan PALIT, Abhinav KARHU, Eugene GORBATOV, Eliezer WEISSMANN
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Patent number: 11100023Abstract: In one example, a semiconductor die includes a plurality of agents and a fabric coupled to at least some of the plurality of agents. The fabric may include at least one router to provide communication between two or more of the plurality of agents, the at least one router coupled to a first agent of the plurality of agents, where the first agent is to send a first message to the at least one router, the first message comprising a first header including a first source identifier, and the at least one router is to validate that the first source identifier is associated with the first agent and if so to direct the first message towards a destination agent, and otherwise to prevent the first message from being directed towards the destination agent. Other embodiments are described and claimed.Type: GrantFiled: September 28, 2017Date of Patent: August 24, 2021Assignee: Intel CorporationInventors: Ruirui Huang, Nilanjan Palit, Robert P. Adler, Ioannis T. Schoinas, Avishay Snir, Boris Dolgunov
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Publication number: 20190095372Abstract: In one example, a semiconductor die includes a plurality of agents and a fabric coupled to at least some of the plurality of agents. The fabric may include at least one router to provide communication between two or more of the plurality of agents, the at least one router coupled to a first agent of the plurality of agents, where the first agent is to send a first message to the at least one router, the first message comprising a first header including a first source identifier, and the at least one router is to validate that the first source identifier is associated with the first agent and if so to direct the first message towards a destination agent, and otherwise to prevent the first message from being directed towards the destination agent. Other embodiments are described and claimed.Type: ApplicationFiled: September 28, 2017Publication date: March 28, 2019Inventors: Ruirui Huang, Nilanjan Palit, Robert P. Adler, Ioannis T. Schoinas, Avishay Snir, Boris Dolgunov