Patents by Inventor Nilanjan Z. GHOSH

Nilanjan Z. GHOSH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10078204
    Abstract: Embodiments include devices, systems and processes for using a combined confocal Raman microscope for inspecting a photo resist film material layer formed on the top surface of a layer of a substrate package, to detect border defects between regions of light exposed (e.g., cured) and unexposed (e.g., uncured) resist film material. Use of the confocal Raman microscope may provide a 3D photo-resist chemical imaging and characterization technique based on combining (1) Raman spectroscopy to identify the borders between regions of light exposed and unexposed resist along XY planes, with (2) Confocal imaging to select a Z-height of the XY planes scanned. Such detection provides fast, high resolution, non-destructive in-line inspection, and improves technical development of polymerization profiles of the resist film material.
    Type: Grant
    Filed: March 29, 2014
    Date of Patent: September 18, 2018
    Assignee: Intel Corporation
    Inventors: Nilanjan Z. Ghosh, Kevin T. McCarthy, Zhiyong Wang, Deepak Goyal, Changhua Liu, Leonel R. Arana
  • Patent number: 9746428
    Abstract: Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: August 29, 2017
    Assignee: Intel Corporation
    Inventors: Shuhong Liu, Zhiyong Wang, Nilanjan Z. Ghosh, Deepak Goyal
  • Patent number: 9508610
    Abstract: A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.
    Type: Grant
    Filed: September 27, 2014
    Date of Patent: November 29, 2016
    Assignee: Intel Corporation
    Inventors: Shuhong Liu, Nilanjan Z. Ghosh, Zhiyong Wang, Deepak Goyal, Shripad Gokhale, Jieping Zhang
  • Publication number: 20160245758
    Abstract: Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.
    Type: Application
    Filed: May 4, 2016
    Publication date: August 25, 2016
    Inventors: Shuhong Liu, Zhiyong Wang, Nilanjan Z. Ghosh, Deepak Goyal
  • Publication number: 20160093540
    Abstract: A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.
    Type: Application
    Filed: September 27, 2014
    Publication date: March 31, 2016
    Inventors: Shuhong LIU, Nilanjan Z. GHOSH, Zhiyong WANG, Deepak GOYAL, Shripad GOKHALE, Jieping ZHANG