Patents by Inventor Nilesh Savargaonkar

Nilesh Savargaonkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230406973
    Abstract: Provided herein are polyethylene compositions having a combination of properties including: density from about 0.930 to 0.975 g/cm3; broad molecular weight distributions (Mw/Mn?10 and/or Mz/Mn?80) and a highly branched architecture (e.g., g?LCB less than or equal to 0.85, preferably less than or equal to 0.75). The polyethylene compositions may further have a low molecular weight fraction (LMWF) and a high molecular weight fraction (HMWF), such that the wt % of LMWF in the compositions is greater than the wt % of HMWF. The polyethylene compositions may be suitable for making films, particularly oriented films such as uni axially (machine-direction-oriented) or biaxially-oriented films, and in particular all-PE films.
    Type: Application
    Filed: December 1, 2021
    Publication date: December 21, 2023
    Inventors: Nino RUOCCO, Nilesh SAVARGAONKAR, Timothy M. BOLLER, Etienne R.H. LERNOUX, Robert M. CANRIGHT
  • Patent number: 11396168
    Abstract: Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a silicon oxide layer, a first adhesive layer, and a sealant film, where the first adhesive layer is located between the barrier film and the sealant film, and where the multi-ply structure has been microwaved in a pressurized vessel. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: July 26, 2022
    Assignee: PRINTPACK ILLINOIS, INC.
    Inventors: Justin Houck, James Ray, Nilesh Savargaonkar
  • Publication number: 20210331453
    Abstract: Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a silicon oxide layer, a first adhesive layer, and a sealant film, where the first adhesive layer is located between the barrier film and the sealant film, and where the multi-ply structure has been microwaved in a pressurized vessel. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.
    Type: Application
    Filed: July 6, 2021
    Publication date: October 28, 2021
    Applicant: Printpack Illinois, Inc.
    Inventors: Justin Houck, James Ray, Nilesh Savargaonkar
  • Patent number: 11090913
    Abstract: Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a silicon oxide layer, a first adhesive layer, and a sealant film, where the first adhesive layer is located between the barrier film and the sealant film, and where the multi-ply structure has been microwaved in a pressurized vessel. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: August 17, 2021
    Assignee: PRINTPACK ILLINOIS, INC.
    Inventors: Justin Houck, James Ray, Nilesh Savargaonkar
  • Patent number: 10800148
    Abstract: Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a barrier coating layer, a first adhesive layer, and a multi-layered sealant film, where the first adhesive layer is located between the barrier film and the multi-layered sealant film. In one or more embodiments, the multi-layered sealant film includes three nylon layers, a polyolefin layer, four tie layers, and a sealing layer. In one or more embodiments, the multi-layered sealant film includes three nylon layers, two polyolefin layers, three tie layers, and a sealing layer. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: October 13, 2020
    Assignee: Printpack Illinois, Inc.
    Inventors: Nilesh Savargaonkar, James Ray, Justin Houck
  • Publication number: 20190240959
    Abstract: Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a barrier coating layer, a first adhesive layer, and a multi-layered sealant film, where the first adhesive layer is located between the barrier film and the multi-layered sealant film. In one or more embodiments, the multi-layered sealant film includes three nylon layers, a polyolefin layer, four tie layers, and a sealing layer. In one or more embodiments, the multi-layered sealant film includes three nylon layers, two polyolefin layers, three tie layers, and a sealing layer. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.
    Type: Application
    Filed: June 30, 2017
    Publication date: August 8, 2019
    Applicant: Printpack Illinois, Inc.
    Inventors: Nilesh Savargaonkar, James Ray, Justin Houck
  • Publication number: 20190240962
    Abstract: Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a silicon oxide layer, a first adhesive layer, and a sealant film, where the first adhesive layer is located between the barrier film and the sealant film, and where the multi-ply structure has been microwaved in a pressurized vessel. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.
    Type: Application
    Filed: June 30, 2017
    Publication date: August 8, 2019
    Applicant: Printpack Illinois, Inc.
    Inventors: Justin Houck, James Ray, Nilesh Savargaonkar
  • Patent number: 7365117
    Abstract: An ethylene polymer composition having improved optical properties and masterbatch for producing the composition comprising a predetermined amount of clarifying agent, and a predetermined amount of an amide slip agent.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: April 29, 2008
    Assignee: Ampacet Corporation
    Inventors: Don Beuke, Phil Pickett, Prakash Patel, Shawn Lucas, Prashant Trivedi, Nilesh Savargaonkar
  • Publication number: 20060122294
    Abstract: An ethylene polymer composition having improved optical properties and masterbatch for producing the composition comprising a predetermined amount of clarifying agent, and a predetermined amount of an amide slip agent.
    Type: Application
    Filed: December 2, 2004
    Publication date: June 8, 2006
    Inventors: Don Beuke, Phil Pickett, Prakash Patel, Shawn Lucas, Prashant Trivedi, Nilesh Savargaonkar