Patents by Inventor Nils Bossemeyer

Nils Bossemeyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device package, and method
    Patent number: 6350954
    Abstract: An electronic package (100) has a semiconductor device (130), a two-layer (110, 120) printed circuit substrate (101), and a lead (140) for providing external connections for the package assembly (100). The first layer (110) has an electrical conducting surface structure (112); and the second layer (120) has a recess (125) to receive the device (130). The device frontside (131) is electrically coupled to the conducting surface structure (112) of the first layer (110) in a flip-chip arrangement. The backside (132) of the device (130) is coplanar to the surface (112) of the second layer (120). The lead (140) at least partially overlays the surface (122) of the second layer (120).
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: February 26, 2002
    Assignee: Motorola Inc.
    Inventors: Will Specks, Nils Bossemeyer, Mervi Paulasto