Patents by Inventor Nils Lundberg
Nils Lundberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11610429Abstract: A fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device comprises connection pads for connecting to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure, arranged to cover the fingerprint sensor device, having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. The fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.Type: GrantFiled: January 29, 2021Date of Patent: March 21, 2023Assignee: FINGERPRINT CARDS ANACATUM IP ABInventors: Nils Lundberg, Zhimin Mo, Mats Slottner
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Patent number: 11023702Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device.Type: GrantFiled: July 16, 2019Date of Patent: June 1, 2021Assignee: Fingerprint Cards ABInventors: Nils Lundberg, Zhimin Mo, Mats Slottner
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Publication number: 20210150175Abstract: A fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device comprises connection pads for connecting to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure, arranged to cover the fingerprint sensor device, having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. The fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.Type: ApplicationFiled: January 29, 2021Publication date: May 20, 2021Applicant: Fingerprint Cards ABInventors: Nils LUNDBERG, Zhimin MO, Mats SLOTTNER
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Publication number: 20190340406Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device.Type: ApplicationFiled: July 16, 2019Publication date: November 7, 2019Applicant: Fingerprint Cards ABInventors: Nils LUNDBERG, Zhimin MO, Mats SLOTTNER
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Patent number: 10395164Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.Type: GrantFiled: November 9, 2017Date of Patent: August 27, 2019Assignee: Fingerprint Cards ABInventors: Nils Lundberg, Zhimin Mo, Mats Slottner
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Publication number: 20180215852Abstract: This invention relates to monodisperse cross-linked hydrogel polymer particles comprising a polymer formed from (a) a hydrophilic vinylic monomer; and (b) a crosslinker comprising at least two vinyl groups. The invention also relates to monodisperse seed particles with a Z-average diameter of from 100 nm to 1500 nm that comprise a plurality of non-crosslinked oligomers of poly N,N-dimethylacrylamide. Also provided are methods of forming the monodisperse cross-linked hydrogel polymer particles and monodisperse seed particles.Type: ApplicationFiled: July 19, 2016Publication date: August 2, 2018Applicant: SINTEFInventors: Geir FONNUM, Nils LUNDBERG, Muhammed GOKMEN, Synne LARSEN, Wilhelm Glomm, Heidi Johnsen, Ruth SCHMID, Lars Kilaas
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Publication number: 20180174018Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.Type: ApplicationFiled: November 9, 2017Publication date: June 21, 2018Applicant: Fingerprint Cards ABInventors: Nils LUNDBERG, Zhimin MO, Mats SLOTTNER
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Patent number: 9129929Abstract: A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.Type: GrantFiled: April 11, 2013Date of Patent: September 8, 2015Assignees: Sony Corporation, Sony Mobile Communications ABInventor: Nils Lundberg
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Publication number: 20130277821Abstract: A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.Type: ApplicationFiled: April 11, 2013Publication date: October 24, 2013Applicant: SONY MOBILE COMMUNICATIONS ABInventor: Nils LUNDBERG
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Publication number: 20090218682Abstract: An integrated circuit package comprising at least one semiconductor chip of a first material, wherein the semiconductor chip comprises an active part and a passive part that is connected to each other, the passive part comprises at least one cavity, the at least one cavity is filled with a filler of a second material, and the thermal conductivity of the second material is higher than the thermal conductivity of the first material.Type: ApplicationFiled: March 3, 2008Publication date: September 3, 2009Inventor: Nils LUNDBERG
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Patent number: 6104043Abstract: A Schottky diode of SiC has a substrate layer, a drift layer and emitter layer regions formed in the drift layer. A metal layer makes an ohmic contact to the emitter layer regions and Schottky contact to the drift layer. A depletion of the drift layer region between two adjacent emitter layer regions is allowed in the blocking state of the diode making the two adjacent p-type emitter layer regions form a continuous depleted region therebetween in this state.Type: GrantFiled: February 20, 1997Date of Patent: August 15, 2000Assignee: ABB Research Ltd.Inventors: Willy Hermansson, Bo Bijlenga, Lennart Ramberg, Kurt Rottner, Lennart Zdansky, Christopher Ian Harris, Mietek Bakowski, Adolf Schoner, Nils Lundberg, Mikael Ostling, Fanny Dahlquist