Patents by Inventor Nim Hak Tea
Nim Hak Tea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10794728Abstract: A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed in the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.Type: GrantFiled: October 30, 2017Date of Patent: October 6, 2020Assignee: invensense, Inc.Inventors: Wesley James Emmanouel Teskey, Nim Hak Tea, Bongsang Kim, Chunchieh Huang
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Publication number: 20180052007Abstract: A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed in the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.Type: ApplicationFiled: October 30, 2017Publication date: February 22, 2018Inventors: WESLEY JAMES EMMANOUEL TESKEY, NIM HAK TEA, BONGSANG KIM, CHUNCHIEH HUANG
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Patent number: 9804007Abstract: A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed adjacent the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.Type: GrantFiled: December 19, 2014Date of Patent: October 31, 2017Assignee: Invensense, Inc.Inventors: Wesley James Emmanouel Teskey, Nim Hak Tea
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Publication number: 20160178415Abstract: A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed adjacent the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.Type: ApplicationFiled: December 19, 2014Publication date: June 23, 2016Inventors: WESLEY JAMES EMMANOUEL TESKEY, NIM HAK TEA
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Patent number: 7759952Abstract: A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.Type: GrantFiled: September 14, 2007Date of Patent: July 20, 2010Assignee: Touchdown Technologies, Inc.Inventors: Raffi Garabedian, Nim Hak Tea, Steven Wang, Heather Karklin
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Patent number: 7728612Abstract: A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.Type: GrantFiled: November 21, 2007Date of Patent: June 1, 2010Assignee: Touchdown Technologies, Inc.Inventors: Raffi Garabedian, Nim Hak Tea, Steven Wang, Heather Karklin
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Publication number: 20080211525Abstract: A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.Type: ApplicationFiled: November 21, 2007Publication date: September 4, 2008Applicant: TOUCHDOWN TECHNOLOGIES, INC.Inventors: Raffi Garabedian, Nim Hak Tea, Steven Wang, Heather Karklin
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Patent number: 7365553Abstract: A probe card assembly has a probe contractor substrate having a plurality of probe contractor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contractor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contractor substrates is substantially parallel to a predetermined reference plane.Type: GrantFiled: December 22, 2005Date of Patent: April 29, 2008Assignee: Touchdown Technologies, Inc.Inventors: Raffi Garabedian, Nim Hak Tea, Steven Wang, Heather Karklin
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Patent number: 7271022Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: GrantFiled: April 11, 2005Date of Patent: September 18, 2007Assignee: Touchdown Technologies, Inc.Inventors: Weilong Tang, Tseng-Yang Hsu, Salleh Ismail, Nim Hak Tea, Melvin B Khoo, Raffi Garabedian, Lakshimikanth Namburi
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Patent number: 7264984Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: GrantFiled: December 21, 2004Date of Patent: September 4, 2007Assignee: Touchdown Technologies, Inc.Inventors: Raffi Garabedian, Salleh Ismail, Nim Hak Tea, Tseng-Yang Hsu, Melvin B Khoo, Weilong Tang
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Patent number: 6666825Abstract: An ultrasound transducer employs a silicon acoustic matching layer closest to the piezoelectric layer in order to achieve improved resolution. A silicon wafer, ground to an appropriate thickness, is included in the acoustic stack with other matching layer materials during transducer construction. The exact thickness is determined by the details of the design, but is nominally a quarter wavelength in the silicon.Type: GrantFiled: July 5, 2001Date of Patent: December 23, 2003Assignee: General Electric CompanyInventors: Lowell Scott Smith, Nim Hak Tea, Theodore Lauer Rhyne, Xuan-Ming Lu
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Publication number: 20030032884Abstract: An ultrasound transducer employs a silicon acoustic matching layer closest to the piezoelectric layer in order to achieve improved resolution. A silicon wafer, ground to an appropriate thickness, is included in the acoustic stack with other matching layer materials during transducer construction. The exact thickness is determined by the details of the design, but is nominally a quarter wavelength in the silicon.Type: ApplicationFiled: July 5, 2001Publication date: February 13, 2003Applicant: General Electric CompanyInventors: Lowell Scott Smith, Nim Hak Tea, Theodore Lauer Rhyne, Xuan-Ming Lu