Abstract: An apparatus for applying an adhesive fluid onto a bonding surface during a bonding process includes a positioning table, a dispensing device, a stamping device and a switching member which are mounted on the positioning table. The dispensing device is configured to be positionable by the positioning table to dispense the adhesive fluid onto the bonding surface. The stamping device is configured to be positionable by the positioning table to stamp the adhesive fluid onto the bonding surface. The dispensing device and stamping device are operative to apply the adhesive fluid onto different bonding positions on the bonding surface. The switching member coupled to the stamping device is configured to move the stamping device to a first standby position when the dispensing device is dispensing the adhesive fluid and to a second standby position when the stamping device is stamping the adhesive fluid.

Abstract: A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.

Abstract: A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.

Abstract: An apparatus for determining an orientation of a die mounted on a tape includes an imaging device, a light source and a conveying mechanism. The die is at least partially translucent and includes at least one orientation feature indicative of the orientation of the die. In use, the conveying mechanism conveys the tape to position the die at an inspection position between the imaging device and the light source. The light source projects light to the imaging device and the imaging device captures an image. The projected light from the light source passing through the die is obstructed by the at least one orientation feature of the die to cause the captured image to include an image of the at least one orientation feature, whereby the orientation of the die may be determined.

Abstract: A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.

Abstract: A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.