Abstract: A graphical profile map for integrated circuits on a substrate. The graphical profile map includes a depiction of die placement boundaries and shot placement boundaries for the integrated circuits on the substrate. Also included are integrated circuit property information contours, where the contours are not limited to either of the die placement boundaries or the shot placement boundaries. In this manner, three key pieces of information for the integrated circuits are presented, including integrated circuit property information, die placement, and shot placement. Because these three pieces of information are presented in a graphical form, it is much easier to interpret the information. For example, it is much easier to determine which shot and die placements have properties that are at risk, and which shot and die placements have adequate property profiles.

Abstract: A graphical profile map for integrated circuits on a substrate. The graphical profile map includes a depiction of die placement boundaries and shot placement boundaries for the integrated circuits on the substrate. Also included are integrated circuit property information contours, where the contours are not limited to either of the die placement boundaries or the shot placement boundaries. In this manner, three key pieces of information for the integrated circuits are presented, including integrated circuit property information, die placement, and shot placement. Because these three pieces of information are presented in a graphical form, it is much easier to interpret the information. For example, it is much easier to determine which shot and die placements have properties that are at risk, and which shot and die placements have adequate property profiles.

Abstract: A graphical profile map for integrated circuits on a substrate. The graphical profile map includes a depiction of die placement boundaries and shot placement boundaries for the integrated circuits on the substrate. Also included are integrated circuit property information contours, where the contours are not limited to either of the die placement boundaries or the shot placement boundaries. In this manner, three key pieces of information for the integrated circuits are presented, including integrated circuit property information, die placement, and shot placement. Because these three pieces of information are presented in a graphical form, it is much easier to interpret the information. For example, it is much easier to determine which shot and die placements have properties that are at risk, and which shot and die placements have adequate property profiles.

Abstract: A data collection system. A data input form receives data, and a message queue receives the data from the data input form, and temporarily manages the data until the data collection system can process the data. A temporary data storage temporarily stores the data received by the message queue while waiting for the data collection system to process the data. A transaction manager receives the data from the message queue and processes the data. A data logger logs the processing transactions of the transaction manager. A data loader receives the data from the transaction manager and prepares the data for storage. A data storage device receives the data from the data loader.

Abstract: The present invention is directed to a system and method for providing access to semiconductor manufacturing information. The present invention system and method allows users to interface with semiconductor characteristic data and to data associated with manufacturing conditions over a network. The system includes at least one input device for entering manufacturing data. A data storage device capable of storing the database of manufacturing data, including semiconductor characteristic data and manufacturing conditions is networked to the at least one input device. A plurality of remote devices suitable for interfacing with the data are networked to the storage device, such that the manufacturing data is provided to a website for access upon occurrence of failure event.

Abstract: The present invention is directed to a system and method for providing access to semiconductor manufacturing information. The present invention system and method allows users to interface with semiconductor characteristic data and to data associated with manufacturing conditions over a network. The system includes at least one input device for entering manufacturing data. A data storage device capable of storing the database of manufacturing data, including semiconductor characteristic data and manufacturing conditions is networked to the at least one input device. A plurality of remote devices suitable for interfacing with the data are networked to the storage device, such that the manufacturing data is provided to a website for access upon occurrence of failure event.