Abstract: A graphical profile map for integrated circuits on a substrate. The graphical profile map includes a depiction of die placement boundaries and shot placement boundaries for the integrated circuits on the substrate. Also included are integrated circuit property information contours, where the contours are not limited to either of the die placement boundaries or the shot placement boundaries. In this manner, three key pieces of information for the integrated circuits are presented, including integrated circuit property information, die placement, and shot placement. Because these three pieces of information are presented in a graphical form, it is much easier to interpret the information. For example, it is much easier to determine which shot and die placements have properties that are at risk, and which shot and die placements have adequate property profiles.

Abstract: A data collection system. A data input form receives data, and a message queue receives the data from the data input form, and temporarily manages the data until the data collection system can process the data. A temporary data storage temporarily stores the data received by the message queue while waiting for the data collection system to process the data. A transaction manager receives the data from the message queue and processes the data. A data logger logs the processing transactions of the transaction manager. A data loader receives the data from the transaction manager and prepares the data for storage. A data storage device receives the data from the data loader.

Abstract: A method for marking a wafer that is cut from a boule. A surface of the boule is marked with an encoded marking that extends completely along a distance of the boule that is used for cutting wafers. The encoded marking is disposed substantially parallel to a length axis of the boule. The wafer is cut from the boule from within the distance, such that the encoded marking along the surface of the boule is disposed at a peripheral edge of the wafer. The encoded marking contains information in regard to the wafer.