Abstract: Embodiments of the present invention relate to a wafer bonding method for heterogenous integration of multiple wafers to a carrier substrate and bonding multiple functional wafers to the substrate to transfer semiconductor thin films. A routing layer for electrical or optical signals is defined on the substrate before a first wafer is bonded to the substrate and is optionally buried with subsequent planarization. Functional ridges are lithographically defined and etched after the first wafer is bonded to the substrate and a thin film is transferred to the substrate. A portion of the wafer surface is then cleared to expose the initial bonding surface on the substrate. A second wafer is bonded to the resulting material by etching pockets in the second functional wafer at the locations of the functional ridges from the first wafer bond.

Abstract: The present invention provides an optical coupler comprising: a first optical prong; a second optical prong; an optical waveguide with which the first optical prong and the second optical prong merge; wherein: a distance from an axially outer tip edge of the first optical prong to an axially outer tip edge of the first optical prong is greater than a planar width of the optical waveguide; and the first optical prong and the second optical prong are each tapered from the optical waveguide.

Abstract: The present invention provides an optical coupler comprising: a first optical prong; a second optical prong; an optical waveguide with which the first optical prong and the second optical prong merge; wherein: a distance from an axially outer tip edge of the first optical prong to an axially outer tip edge of the first optical prong is greater than a planar width of the optical waveguide; and the first optical prong and the second optical prong are each tapered from the optical waveguide.