Patents by Inventor Nimrod HARPAK

Nimrod HARPAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929486
    Abstract: Composite electrodes are described herein, comprising a stainless steel substrate and silicon-containing nanostructures extending from the substrate, as well as processes for preparing such electrodes without requiring a catalyst by pre-treatment of the steel. At least a portion of the silicon-containing nanostructures are characterized by: being substantially devoid of a non-silicon catalyst material and/or a noble metal; and/or including along its length a metal constituent originating from the steel substrate; and/or including a metal silicide extending from the substrate and along at least a portion of its length; and/or being fused with at least one other silicon-containing nanostructure at a location removed from a surface of the substrate to form a sponge-like three-dimensional structure; and/or being stainless steel nanostructures having a layer of silicon disposed thereon.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: March 12, 2024
    Assignee: Technology Innovation Momentum Fund (Israel) Limited Partnership
    Inventors: Fernando Patolsky, Guy Davidy, Nimrod Harpak
  • Publication number: 20200358083
    Abstract: Composite electrodes are described herein, comprising a stainless steel substrate and silicon-containing nanostructures extending from the substrate, as well as processes for preparing such electrodes without requiring a catalyst by pre-treatment of the steel. At least a portion of the silicon-containing nanostructures are characterized by: being substantially devoid of a non-silicon catalyst material and/or a noble metal; and/or including along its length a metal constituent originating from the steel substrate; and/or including a metal silicide extending from the substrate and along at least a portion of its length; and/or being fused with at least one other silicon-containing nanostructure at a location removed from a surface of the substrate to form a sponge-like three-dimensional structure; and/or being stainless steel nanostructures having a layer of silicon disposed thereon.
    Type: Application
    Filed: October 31, 2018
    Publication date: November 12, 2020
    Applicant: Technology Innovation Momentum Fund (Israel) Limited Partnership
    Inventors: Fernando PATOLSKY, Guy DAVIDY, Nimrod HARPAK