Patents by Inventor Nina D. Morozova

Nina D. Morozova has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7653109
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: January 26, 2010
    Assignee: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim W. Li, Nina D. Morozova
  • Patent number: 7235150
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: June 26, 2007
    Assignee: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim W. Li, Nina D. Morozova
  • Publication number: 20040105611
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: July 9, 2003
    Publication date: June 3, 2004
    Applicant: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim Weijian Li, Nina D. Morozova
  • Publication number: 20030133668
    Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.
    Type: Application
    Filed: January 3, 2003
    Publication date: July 17, 2003
    Inventors: David K. Wagner, Harald Guenther, William K. Bischel, Jim Weijian Li, Nina D. Morozova
  • Publication number: 20020110328
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 15, 2002
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim Weijian Li, Nina D. Morozova
  • Publication number: 20020110335
    Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 15, 2002
    Inventors: David K. Wagner, Harald Guenther, William K. Bischel, Jim Weijian Li, Nina D. Morozova