Patents by Inventor Nina Pirilä

Nina Pirilä has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming low-dielectrics using a rapid curing process
    Patent number: 7622399
    Abstract: A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1° C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: November 24, 2009
    Assignee: Silecs Oy
    Inventors: Jason Reid, Nigel Hackera, Nina Pirilä, Juha Rantala, William McLaughlin